Inventor
HUANG CHIEN-CHUNG
TW91 patents
⚠️ This page may combine multiple inventors who share the name “HUANG CHIEN-CHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
18 patentsUS6849541B1Feb 1, 2005
Method of fabricating a dual damascene copper wire
UNITED MICROELECTRONICS CORP29 citations92
US6204096B1Mar 20, 2001
Method for reducing critical dimension of dual damascene process using spin-on-glass process
UNITED MICROELECTRONICS CORP24 citations91
US7485515B2Feb 3, 2009
Method of manufacturing metal oxide semiconductor
UNITED MICROELECTRONICS CORP8 citations84
US6255162B1Jul 3, 2001
Method of gap filling
UNITED MICROELECTRONICS CORP15 citations82
US9401417B2Jul 26, 2016
Method of manufacturing a semiconductor device
UNITED MICROELECTRONICS CORP6 citations81
US7777284B2Aug 17, 2010
Metal-oxide-semiconductor transistor and method of forming the same
UNITED MICROELECTRONICS CORP6 citations74
US7199040B2Apr 3, 2007
Barrier layer structure
UNITED MICROELECTRONICS CORP8 citations74
US6077789AJun 20, 2000
Method for forming a passivation layer with planarization
UNITED MICROELECTRONICS CORP13 citations74
US9721840B2Aug 1, 2017
Method of forming complementary metal oxide semiconductor device with work function layer
UNITED MICROELECTRONICS CORP2 citations73
US9502305B2Nov 22, 2016
Method for manufacturing CMOS transistor
UNITED MICROELECTRONICS CORP4 citations73
US9412743B2Aug 9, 2016
Complementary metal oxide semiconductor device
UNITED MICROELECTRONICS CORP3 citations73
US9397189B2Jul 19, 2016
Semiconductor structure having a metal gate with side wall spacers
UNITED MICROELECTRONICS CORP3 citations73
US7397124B2Jul 8, 2008
Process of metal interconnects
UNITED MICROELECTRONICS CORP8 citations73
US6239024B1May 29, 2001
Method of filling gap with dielectrics
UNITED MICROELECTRONICS CORP7 citations72
US8350246B2Jan 8, 2013
Structure of porous low-k layer and interconnect structure
UNITED MICROELECTRONICS CORP2 citations63
US7947565B2May 24, 2011
Forming method of porous low-k layer and interconnect process
UNITED MICROELECTRONICS CORP4 citations63
US7662730B2Feb 16, 2010
Method for fabricating ultra-high tensile-stressed film and strained-silicon transistors thereof
UNITED MICROELECTRONICS CORP4 citations63
US7566668B2Jul 28, 2009
Method of forming contact
UNITED MICROELECTRONICS CORP3 citations63
TAIWAN SEMICONDUCTOR MFG CO LTD
15 patentsUS11101429B2Aug 24, 2021
Metal etching stop layer in magnetic tunnel junction memory cells
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10862023B2Dec 8, 2020
Semiconductor structure and manufacturing method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10651373B2May 12, 2020
Memory device and fabrication method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US12219879B2Feb 4, 2025
Gradient protection layer in MTJ manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations74
US11683991B2Jun 20, 2023
Semiconductor structure and manufacturing method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11411176B2Aug 9, 2022
Gradient protection layer in MTJ manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10868239B2Dec 15, 2020
Gradient protection layer in MTJ manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10157997B2Dec 18, 2018
FinFETs and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US12317751B2May 27, 2025
Integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11944017B2Mar 26, 2024
Semiconductor structure and manufacturing method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11856865B2Dec 26, 2023
Gradient protection layer in MTJ manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11800812B2Oct 24, 2023
Integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11665971B2May 30, 2023
Metal etching stop layer in magnetic tunnel junction memory cells
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11527476B2Dec 13, 2022
Interconnect structure of semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11271150B2Mar 8, 2022
Integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
TAIWAN SEMICONDUCTOR MFG
3 patentsUS6119736ASep 19, 2000
Vehicle for transporting wet objects
TAIWAN SEMICONDUCTOR MFG23 citations86
US6775584B1Aug 10, 2004
Operation-supervision integrated interface
TAIWAN SEMICONDUCTOR MFG17 citations81
US5974627ANov 2, 1999
Handle for standard mechanical interface (SMIF) pod
TAIWAN SEMICONDUCTOR MFG6 citations63
CHEN YI-WEI
2 patentsHUANG CHIEN-CHUNG
2 patentsTECHWELL INC
1 patentAPACER TECHNOLOGY
1 patentASIA VITAL COMPONENTS CO LTD
1 patentAPACER TECHNOLOGY INC
1 patentE INK HOLDINGS INC
1 patentYANG YU-RU
1 patentV5 TECH CO LTD
1 patentAU OPTRONICS CORP
1 patentBRIGHTEK OPTOELECTRONIC CO LTD
1 patentELICIN MEHMET A
1 patentShowing the top 50 of 91 patents by PatentIndex Score.