P

Inventor

HUANG CHIEN-CHUNG

TW91 patents
⚠️ This page may combine multiple inventors who share the name “HUANG CHIEN-CHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

18 patents
US6849541B1Feb 1, 2005

Method of fabricating a dual damascene copper wire

UNITED MICROELECTRONICS CORP29 citations92
US6204096B1Mar 20, 2001

Method for reducing critical dimension of dual damascene process using spin-on-glass process

UNITED MICROELECTRONICS CORP24 citations91
US7485515B2Feb 3, 2009

Method of manufacturing metal oxide semiconductor

UNITED MICROELECTRONICS CORP8 citations84
US6255162B1Jul 3, 2001

Method of gap filling

UNITED MICROELECTRONICS CORP15 citations82
US9401417B2Jul 26, 2016

Method of manufacturing a semiconductor device

UNITED MICROELECTRONICS CORP6 citations81
US7777284B2Aug 17, 2010

Metal-oxide-semiconductor transistor and method of forming the same

UNITED MICROELECTRONICS CORP6 citations74
US7199040B2Apr 3, 2007

Barrier layer structure

UNITED MICROELECTRONICS CORP8 citations74
US6077789AJun 20, 2000

Method for forming a passivation layer with planarization

UNITED MICROELECTRONICS CORP13 citations74
US9721840B2Aug 1, 2017

Method of forming complementary metal oxide semiconductor device with work function layer

UNITED MICROELECTRONICS CORP2 citations73
US9502305B2Nov 22, 2016

Method for manufacturing CMOS transistor

UNITED MICROELECTRONICS CORP4 citations73
US9412743B2Aug 9, 2016

Complementary metal oxide semiconductor device

UNITED MICROELECTRONICS CORP3 citations73
US9397189B2Jul 19, 2016

Semiconductor structure having a metal gate with side wall spacers

UNITED MICROELECTRONICS CORP3 citations73
US7397124B2Jul 8, 2008

Process of metal interconnects

UNITED MICROELECTRONICS CORP8 citations73
US6239024B1May 29, 2001

Method of filling gap with dielectrics

UNITED MICROELECTRONICS CORP7 citations72
US8350246B2Jan 8, 2013

Structure of porous low-k layer and interconnect structure

UNITED MICROELECTRONICS CORP2 citations63
US7947565B2May 24, 2011

Forming method of porous low-k layer and interconnect process

UNITED MICROELECTRONICS CORP4 citations63
US7662730B2Feb 16, 2010

Method for fabricating ultra-high tensile-stressed film and strained-silicon transistors thereof

UNITED MICROELECTRONICS CORP4 citations63
US7566668B2Jul 28, 2009

Method of forming contact

UNITED MICROELECTRONICS CORP3 citations63

TAIWAN SEMICONDUCTOR MFG CO LTD

15 patents
US11101429B2Aug 24, 2021

Metal etching stop layer in magnetic tunnel junction memory cells

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10862023B2Dec 8, 2020

Semiconductor structure and manufacturing method of the same

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10651373B2May 12, 2020

Memory device and fabrication method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US12219879B2Feb 4, 2025

Gradient protection layer in MTJ manufacturing

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations74
US11683991B2Jun 20, 2023

Semiconductor structure and manufacturing method of the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11411176B2Aug 9, 2022

Gradient protection layer in MTJ manufacturing

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10868239B2Dec 15, 2020

Gradient protection layer in MTJ manufacturing

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10157997B2Dec 18, 2018

FinFETs and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US12317751B2May 27, 2025

Integrated circuit

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11944017B2Mar 26, 2024

Semiconductor structure and manufacturing method of the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11856865B2Dec 26, 2023

Gradient protection layer in MTJ manufacturing

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11800812B2Oct 24, 2023

Integrated circuit

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11665971B2May 30, 2023

Metal etching stop layer in magnetic tunnel junction memory cells

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11527476B2Dec 13, 2022

Interconnect structure of semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11271150B2Mar 8, 2022

Integrated circuit

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

TAIWAN SEMICONDUCTOR MFG

3 patents

CHEN YI-WEI

2 patents

HUANG CHIEN-CHUNG

2 patents

TECHWELL INC

1 patent

APACER TECHNOLOGY

1 patent

ASIA VITAL COMPONENTS CO LTD

1 patent

APACER TECHNOLOGY INC

1 patent

E INK HOLDINGS INC

1 patent

YANG YU-RU

1 patent

V5 TECH CO LTD

1 patent

AU OPTRONICS CORP

1 patent

BRIGHTEK OPTOELECTRONIC CO LTD

1 patent

ELICIN MEHMET A

1 patent

Showing the top 50 of 91 patents by PatentIndex Score.