Inventor

JIANG TONGBI

US298 patents

⚠️ This page may combine multiple inventors who share the name “JIANG TONGBI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JIANG TONGBI

MICRON TECHNOLOGY INC

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Methods for assembling multiple semiconductor devices

Semiconductor device assemblies and packages including multiple semiconductor devices and methods

Z-axis electrical contact for microelectronic devices

Methods of thinning microelectronic workpieces

Passivation layer for packaged integrated circuits

Apparatus and method of stacking die on a substrate

Passivation layer for packaged integrated circuits

Reinforcement of lead bonding in microelectronics packages

Thermally enhanced semiconductor package

Semiconductor die back side surface and method of fabrication

Void-free underfill of surface mounted chips

Anisotropic conductive interconnect material for electronic devices, method of use and resulting product

Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication

Method of fabricating microelectronic devices

Semiconductor device assemblies and packages including multiple semiconductor device components

Micro-lens configuration for small lens focusing in digital imaging devices

Semiconductor substrate for build-up packages

Adhesive composition for use in packaging applications

Electrical interconnections, methods of conducting electricity, and methods of reducing horizontal conductivity within an anisotropic conductive adhesive

Methods for forming conductive micro-bumps and recessed contacts for flip-chip technology and method of flip-chip assembly

Method for fabricating BGA package using substrate with patterned solder mask open in die attach area

Microelectronic assembly with pre-disposed fill material and associated method of manufacture

Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby

Method and apparatus for attaching microelectronic substrates and support members

Total internal reflection (TIR) CMOS imager

Stacked semiconductor package with circuit side polymer layer

Fabrication of stacked microelectronic devices

Semiconductor package with circuit side polymer layer and wafer level fabrication method

Methods of ball grid array

Multi-layered adhesive for attaching a semiconductor die to a substrate

Fluid level sensor

Semiconductor device for attachment to a semiconductor substrate

Method and apparatus for electroless plating a contact pad

Method for in-line testing of flip-chip semiconductor assemblies

Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication

Method and apparatus for electroless plating a contact pad

Electrical interconnections

Plastic lead frames for semiconductor devices

High resolution pressure sensing device having an insulating flexible matrix loaded with filler particles

Method of attaching a leadframe to singulated semiconductor dice

Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive

BGA package having substrate with patterned solder mask defining open die attach area

Composite interposer for BGA packages

Microelectronic assembly with pre-disposed fill material and associated method of manufacture

Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials

Flip chip dip coating encapsulant

JIANG TONGBI

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers