Inventor
MODEN WALTER L
US175 patents
⚠️ This page may combine multiple inventors who share the name “MODEN WALTER L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
49 patentsUS6414391B1Jul 2, 2002
Module assembly for stacked BGA packages with a common bus bar in the assembly
MICRON TECHNOLOGY INC87 citations99
US6326242B1Dec 4, 2001
Semiconductor package with heat sink and method of fabrication
MICRON TECHNOLOGY INC157 citations99
US6297960B1Oct 2, 2001
Heat sink with alignment and retaining features
MICRON TECHNOLOGY INC155 citations99
US6297548B1Oct 2, 2001
Stackable ceramic FBGA for high thermal applications
MICRON TECHNOLOGY INC259 citations99
US6294839B1Sep 25, 2001
Apparatus and methods of packaging and testing die
MICRON TECHNOLOGY INC352 citations99
US6265766B1Jul 24, 2001
Flip chip adaptor package for bare die
MICRON TECHNOLOGY INC263 citations99
US6258623B1Jul 10, 2001
Low profile multi-IC chip package connector
MICRON TECHNOLOGY INC354 citations99
US6225689B1May 1, 2001
Low profile multi-IC chip package connector
MICRON TECHNOLOGY INC295 citations99
US6201304B1Mar 13, 2001
Flip chip adaptor package for bare die
MICRON TECHNOLOGY INC118 citations99
US6072233AJun 6, 2000
Stackable ball grid array package
MICRON TECHNOLOGY INC579 citations99
US6066514AMay 23, 2000
Adhesion enhanced semiconductor die for mold compound packaging
MICRON TECHNOLOGY INC113 citations99
US6049125AApr 11, 2000
Semiconductor package with heat sink and method of fabrication
MICRON TECHNOLOGY INC185 citations99
US5719440AFeb 17, 1998
Flip chip adaptor package for bare die
MICRON TECHNOLOGY INC94 citations99
US5214845AJun 1, 1993
Method for producing high speed integrated circuits
MICRON TECHNOLOGY INC407 citations99
US5140404AAug 18, 1992
Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
MICRON TECHNOLOGY INC208 citations99
US6709893B2Mar 23, 2004
Interconnections for a semiconductor device and method for forming same
MICRON TECHNOLOGY INC94 citations98
US6563217B2May 13, 2003
Module assembly for stacked BGA packages
MICRON TECHNOLOGY INC76 citations98
US6512303B2Jan 28, 2003
Flip chip adaptor package for bare die
MICRON TECHNOLOGY INC86 citations98
US7381591B2Jun 3, 2008
Flip-chip adaptor package for bare die
MICRON TECHNOLOGY INC46 citations96
US7329945B2Feb 12, 2008
Flip-chip adaptor package for bare die
MICRON TECHNOLOGY INC43 citations96
US6838768B2Jan 4, 2005
Module assembly for stacked BGA packages
MICRON TECHNOLOGY INC35 citations96
US6760224B2Jul 6, 2004
Heat sink with alignment and retaining features
MICRON TECHNOLOGY INC60 citations96
US6686655B2Feb 3, 2004
Low profile multi-IC chip package connector
MICRON TECHNOLOGY INC45 citations96
US6667556B2Dec 23, 2003
Flip chip adaptor package for bare die
MICRON TECHNOLOGY INC66 citations96
US6650007B2Nov 18, 2003
Stackable ceramic fbga for high thermal applications
MICRON TECHNOLOGY INC36 citations96
US6512302B2Jan 28, 2003
Apparatus and methods of packaging and testing die
MICRON TECHNOLOGY INC46 citations96
US6486546B2Nov 26, 2002
Low profile multi-IC chip package connector
MICRON TECHNOLOGY INC47 citations96
US6455928B2Sep 24, 2002
Stackable ball grid array package
MICRON TECHNOLOGY INC41 citations96
US6414374B2Jul 2, 2002
Semiconductor device including edge bond pads and methods
MICRON TECHNOLOGY INC62 citations96
US6410406B1Jun 25, 2002
Semiconductor device including edge bond pads and methods
MICRON TECHNOLOGY INC28 citations96
US6380631B2Apr 30, 2002
Apparatus and methods of packaging and testing die
MICRON TECHNOLOGY INC37 citations96
US6331939B1Dec 18, 2001
Stackable ball grid array package
MICRON TECHNOLOGY INC47 citations96
US6310288B1Oct 30, 2001
Underfill coating for loc package
MICRON TECHNOLOGY INC71 citations96
US6268649B1Jul 31, 2001
Stackable ball grid array package
MICRON TECHNOLOGY INC73 citations96
US6265773B1Jul 24, 2001
Vertically mountable and alignable semiconductor device, assembly, and methods
MICRON TECHNOLOGY INC28 citations96
US6235551B1May 22, 2001
Semiconductor device including edge bond pads and methods
MICRON TECHNOLOGY INC39 citations96
US6153929ANov 28, 2000
Low profile multi-IC package connector
MICRON TECHNOLOGY INC46 citations96
US6088237AJul 11, 2000
Semiconductor device socket, assembly and methods
MICRON TECHNOLOGY INC43 citations96
US6017776AJan 25, 2000
Method of attaching a leadframe to singulated semiconductor dice
MICRON TECHNOLOGY INC62 citations96
US5995378ANov 30, 1999
Semiconductor device socket, assembly and methods
MICRON TECHNOLOGY INC57 citations96
US5956236ASep 21, 1999
Integrated circuit package support system
MICRON TECHNOLOGY INC58 citations96
US5943557AAug 24, 1999
Method and structure for attaching a semiconductor die to a lead frame
MICRON TECHNOLOGY INC54 citations96
US5940277AAug 17, 1999
Semiconductor device including combed bond pad opening, assemblies and methods
MICRON TECHNOLOGY INC50 citations96
US5920123AJul 6, 1999
Multichip module assembly having via contacts and method of making the same
MICRON TECHNOLOGY INC54 citations96
US5733800AMar 31, 1998
Underfill coating for LOC package
MICRON TECHNOLOGY INC74 citations96
US5548160AAug 20, 1996
Method and structure for attaching a semiconductor die to a lead frame
MICRON TECHNOLOGY INC80 citations96
US5304842AApr 19, 1994
Dissimilar adhesive die attach for semiconductor devices
MICRON TECHNOLOGY INC282 citations96
US5177032AJan 5, 1993
Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
MICRON TECHNOLOGY INC105 citations96
US5539251AJul 23, 1996
Tie bar over chip lead frame design
MICRON TECHNOLOGY INC227 citations94
MODEN WALTER L
1 patentShowing the top 50 of 175 patents by PatentIndex Score.