Inventor
HOANG JOHN
US15 patents
⚠️ This page may combine multiple inventors who share the name “HOANG JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
10 patentsUS9870899B2Jan 16, 2018
Cobalt etch back
LAM RES CORP32 citations93
US10784086B2Sep 22, 2020
Cobalt etch back
LAM RES CORP9 citations83
US10199235B2Feb 5, 2019
Liner and barrier applications for subtractive metal integration
LAM RES CORP2 citations72
US9570320B2Feb 14, 2017
Method to etch copper barrier film
LAM RES CORP3 citations72
US11832533B2Nov 28, 2023
Conformal damage-free encapsulation of chalcogenide materials
LAM RES CORP0 citations60
US11239420B2Feb 1, 2022
Conformal damage-free encapsulation of chalcogenide materials
LAM RES CORP1 citations60
US11792987B2Oct 17, 2023
Self-aligned vertical integration of three-terminal memory devices
LAM RES CORP0 citations59
US9899234B2Feb 20, 2018
Liner and barrier applications for subtractive metal integration
LAM RES CORP1 citations51
US12080592B2Sep 3, 2024
Film stack simplification for high aspect ratio patterning and vertical scaling
LAM RES CORP0 citations46
US9589853B2Mar 7, 2017
Method of planarizing an upper surface of a semiconductor substrate in a plasma etch chamber
LAM RES CORP0 citations41