Inventor
LEE HYOSAN
KR29 patents
⚠️ This page may combine multiple inventors who share the name “LEE HYOSAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
25 patentsUS10361100B2Jul 23, 2019
Apparatus and methods for treating a substrate
SAMSUNG ELECTRONICS CO LTD7 citations83
US9831081B2Nov 28, 2017
Method for treating substrate
SAMSUNG ELECTRONICS CO LTD3 citations73
US10991600B2Apr 27, 2021
Process chamber and substrate processing apparatus including the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US9941110B2Apr 10, 2018
Manufacturing method and fluid supply system for treating substrate
SAMSUNG ELECTRONICS CO LTD3 citations72
US9595434B2Mar 14, 2017
Apparatus and methods for manufacturing semiconductor devices and treating substrates
SAMSUNG ELECTRONICS CO LTD6 citations72
US9524864B2Dec 20, 2016
Manufacturing method and fluid supply system for treating substrate
SAMSUNG ELECTRONICS CO LTD3 citations72
US11028488B2Jun 8, 2021
Etching composition, a method of etching a metal barrier layer and a metal layer using the same, and method of manufacturing semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD3 citations71
US10388537B2Aug 20, 2019
Cleaning apparatus, chemical mechanical polishing system including the same, cleaning method after chemical mechanical polishing, and method of manufacturing semiconductor device including the same
SAMSUNG ELECTRONICS CO LTD3 citations71
US9852921B2Dec 26, 2017
Substrate treating apparatus and method of treating substrate
SAMSUNG ELECTRONICS CO LTD2 citations71
US9677002B2Jun 13, 2017
Etching composition
SAMSUNG ELECTRONICS CO LTD2 citations71
US9534839B2Jan 3, 2017
Apparatus and methods for treating a substrate
SAMSUNG ELECTRONICS CO LTD5 citations70
US11390805B2Jul 19, 2022
Etching composition and method for manufacturing semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD3 citations68
US11610788B2Mar 21, 2023
Process chamber and substrate processing apparatus including the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11795550B2Oct 24, 2023
Etching composition, a method of etching a metal barrier layer and a metal layer using the same, and method of manufacturing semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US7431855B2Oct 7, 2008
Apparatus and method for removing photoresist from a substrate
SAMSUNG ELECTRONICS CO LTD3 citations56
US12319841B2Jun 3, 2025
Slurry composition for chemical mechanical polishing
SAMSUNG ELECTRONICS CO LTD0 citations55
US11427759B2Aug 30, 2022
Etchant compositions for metal-containing films and methods of manufacturing integrated circuit devices using the etchant compositions
SAMSUNG ELECTRONICS CO LTD0 citations54
US11168253B2Nov 9, 2021
Silicon layer etchant composition and method of forming pattern by using the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US12590247B2Mar 31, 2026
Etching composition, method of etching metal-containing film by using the same, and method of preparing semiconductor device by using the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US11189503B2Nov 30, 2021
Substrate drying method, photoresist developing method, photolithography method including the same, and substrate drying system
SAMSUNG ELECTRONICS CO LTD0 citations51
US10186427B2Jan 22, 2019
Substrate treating apparatus
SAMSUNG ELECTRONICS CO LTD0 citations50
US9165759B2Oct 20, 2015
Etching composition and method of manufacturing semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD1 citations50
US10837115B2Nov 17, 2020
Pre-treatment composition before etching SiGe and method of fabricating semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD0 citations49
US12234400B2Feb 25, 2025
Etchant composition for etching silicon germanium film and method of manufacturing integrated circuit device by using the same
SAMSUNG ELECTRONICS CO LTD0 citations46
US9934959B2Apr 3, 2018
Method and apparatus for purifying cleaning agent
SAMSUNG ELECTRONICS CO LTD0 citations41