Inventor

JOHNSON C MARK

GB4 patents

⚠️ This page may combine multiple inventors who share the name “JOHNSON C MARK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DENSO CORP

2 patents

US7999369B2Aug 16, 2011

Power electronic package having two substrates with multiple semiconductor chips and electronic components

DENSO CORP62 citations95

US7557434B2Jul 7, 2009

Power electronic package having two substrates with multiple electronic components

DENSO CORP19 citations81

MALHAN RAJESH KUMAR

1 patent

US8432030B2Apr 30, 2013

Power electronic package having two substrates with multiple semiconductor chips and electronic components

MALHAN RAJESH KUMAR12 citations80

VIRGINIA TECH INTELLECTUAL PROPERTIES INC

1 patent

US11956914B2Apr 9, 2024

Sealed interface power module housing

VIRGINIA TECH INTELLECTUAL PROPERTIES INC0 citations55