Inventor

PALM PETTERI

DE84 patents

⚠️ This page may combine multiple inventors who share the name “PALM PETTERI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PALM PETTERI

INFINEON TECHNOLOGIES AG

Method for forming electronic components

Device including semiconductor chips and method for producing such device

Die package and method of manufacturing a die package

Die package and method of forming a die package

Die package and method of forming a die package

Method of forming contacts to an embedded semiconductor die and related semiconductor packages

Power stage device with carrier frame for power stage module and integrated inductor

Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate

Device including semiconductor chips and method for producing such device

Electronic device package including metal blocks

Semiconductor device and method for manufacturing a semiconductor device

Method of manufacturing a chip arrangement comprising disposing a metal structure over a carrier

Space efficient and low parasitic half bridge

Hybrid antenna, antenna arrangement and method for manufacturing an antenna arrangement

Semiconductor device package comprising side walls connected with contact pads of a semiconductor die

Die package and method of forming a die package

Forming a lock structure in a semiconductor chip pad

Device including semiconductor chips and method for producing such device

Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate

Device including semiconductor chips and method for producing such device

Device including semiconductor chips and method for producing such device

Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate

TUOMINEN RISTO

Method for manufacturing an electronic module and an electronic module

Method for manufacturing an electronic module and an electronic module

Method for manufacturing a circuit board structure

Method for manufacturing a circuit board

Heat conduction from an embedded component

Circuit board including an embedded component

Method for manufacturing a circuit board structure, and a circuit board structure

IMBERA ELECTRONICS OY

Manufacture of a layer including a component

Electronic module with a conductive-pattern layer and a method of manufacturing same

Electronic module

Method for manufacturing an electronic module

Electronic module with a conductive-pattern layer and a method of manufacturing same

PALM PETTERI

Circuit module and method of manufacturing the same

Electronic module with embedded jumper conductor

Circuit module and method of manufacturing the same

Circuit module and method of manufacturing the same

INFINEON TECHNOLOGIES AUSTRIA AG

Die embedding

Semiconductor package and method of fabricating a semiconductor package

Semiconductor device module having vertical metallic contacts and a method for fabricating the same

Method of fabricating a semiconductor package

GE EMBEDDED ELECTRONICS OY

Manufacture of a circuit board and circuit board containing a component

Electronic module

Method for manufacturing a circuit board structure

IMBERATEK LLC

Circuit board structure and method for manufacturing a circuit board structure

Circuit board structure and method for manufacturing a circuit board structure

Electronic module

IIHOLA ANTTI

Method for manufacturing an electronics module comprising a component electrically connected to a conductor-pattern layer

Electronic module with vertical connector between conductor patterns