Inventor

LEE Y J

TW3 patents

⚠️ This page may combine multiple inventors who share the name “LEE Y J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHIPMOS TECHNOLOGIES INC

2 patents

US6605480B2Aug 12, 2003

Wafer level packaging for making flip-chips

CHIPMOS TECHNOLOGIES INC4 citations60

US7005054B2Feb 28, 2006

Method for manufacturing probes of a probe card

CHIPMOS TECHNOLOGIES INC0 citations48

CHIPMOS TECHNOLOGIES BERMUDA

1 patent

US6686615B1Feb 3, 2004

Flip-chip type semiconductor device for reducing signal skew

CHIPMOS TECHNOLOGIES BERMUDA35 citations89