Inventor

NGUYEN TUE

US99 patents

⚠️ This page may combine multiple inventors who share the name “NGUYEN TUE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NGUYEN TUE

SHARP LAB OF AMERICA INC

System and method of selectively cleaning copper substrate surfaces, in-situ, to remove copper oxides

Method to enhance the adhesion of silicon nitride to low-k fluorinated amorphous carbon using a silicon carbide adhesion promoter layer

Multi-level reticle system and method for forming multi-level resist profiles

Use of a silicon carbide adhesion promoter layer to enhance the adhesion of silicon nitride to low-k fluorinated amorphous carbon

Method of making metal gate sub-micron MOS transistor

Low resistance contact between circuit metal levels

Enhanced CVD copper adhesion by two-step deposition process

Method for transferring a multi-level photoresist pattern

Semiconductor wafer with removed CVD copper

Alkene ligand precursor and synthesis method

Method of forming polycrystalline silicon TFTs with TiN/Cu/TiN interconnections for a liquid crystal display pixel array

SHARP MICROELECT TECH INC

Low resistance contact between integrated circuit metal levels and method for same

Low temperature system and method for CVD copper removal

Hard mask method for transferring a multi-level photoresist pattern

Method for a chemical vapor deposition of copper on an ion prepared conductive surface

Copper adhesion to a diffusion barrier surface and method for same

Method of making low-k fluorinated amorphous carbon dielectric

Differential copper deposition on integrated circuit surfaces and method for same

Method of using water vapor to increase the conductivity of cooper desposited with cu(hfac)TMVS

Precursor with (alkyloxy)(alkyl)-silylolefin ligand to deposit copper

Oxidized diffusion barrier surface for the adherence of copper and method for same

TEGAL CORP

Nanolayer deposition process

High pressure chemical vapor trapping method

Method to plasma deposit on organic polymer dielectric film

Assembly line processing method

Nanolayer thick film processing system and method

Nanolayer thick film processing system and method

Plasma enhanced pulsed layer deposition

Semiconductor processing system and method

System and method for semiconductor processing

SIMPLUS SYSTEMS CORP

Plasma enhanced pulsed layer deposition

High flow conductance and high thermal conductance showerhead system and method

Three-dimensional showerhead apparatus

Multilayered copper structure for improving adhesion property

Multilayered diffusion barrier structure for improving adhesion property

Replaceable shielding apparatus

Semiconductor processing system and method

Integrated precursor delivery system

Multi-thermal zone shielding apparatus

IBM

Low temperature plasma oxidation process

Method of making TA2 O5 thin film by low temperature ozone plasma annealing (oxidation)

Low temperature plasma oxidation process

Thin capacitor dielectric by rapid thermal processing

DITIZIO ROBERT ANTHONY

Nanolayer deposition using bias power treatment

SHARP KK

Multi-level photoresist profile method

NGUYEN TAI DUNG

3-D printed materials, structures and processes

SHARP MICROELETRONICS TECHNOLO

Method for forming a multi-level reticle

KUMAR ANANDA H

Silicon composite substrates

INTELLEFLEX CORP

Lamination and delamination technique for thin film processing

SHEATS JAMES

Lamination and delamination technique for thin film processing