Inventor
TODOROV VALENTIN N
US8 patents
Patents
8 patentsUS7718538B2May 18, 2010
Pulsed-plasma system with pulsed sample bias for etching semiconductor substrates
APPLIED MATERIALS INC109 citations97
US6962644B2Nov 8, 2005
Tandem etch chamber plasma processing system
APPLIED MATERIALS INC108 citations97
US6447636B1Sep 10, 2002
Plasma reactor with dynamic RF inductive and capacitive coupling control
APPLIED MATERIALS INC215 citations97
US7777152B2Aug 17, 2010
High AC current high RF power AC-RF decoupling filter for plasma reactor heated electrostatic chuck
APPLIED MATERIALS INC26 citations92
US5801386ASep 1, 1998
Apparatus for measuring plasma characteristics within a semiconductor wafer processing system and a method of fabricating and using same
APPLIED MATERIALS INC36 citations92
US6447637B1Sep 10, 2002
Process chamber having a voltage distribution electrode
APPLIED MATERIALS INC22 citations90
US7674394B2Mar 9, 2010
Plasma process for inductively coupling power through a gas distribution plate while adjusting plasma distribution
APPLIED MATERIALS INC17 citations84
US7552736B2Jun 30, 2009
Process for wafer backside polymer removal with a ring of plasma under the wafer
APPLIED MATERIALS INC9 citations84