P

Inventor

HU CHENG-KANG

TW27 patents
⚠️ This page may combine multiple inventors who share the name “HU CHENG-KANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

26 patents
US10569520B2Feb 25, 2020

Wafer debonding system and method

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US10155369B2Dec 18, 2018

Wafer debonding system and method

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US10714364B2Jul 14, 2020

Apparatus and method for inspecting wafer carriers

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11295973B2Apr 5, 2022

Apparatus and method for automated wafer carrier handling

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10889097B2Jan 12, 2021

Wafer debonding system and method

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11423526B2Aug 23, 2022

Optical inspection of a wafer

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US11670524B2Jun 6, 2023

Fully automated wafer debonding system and method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations68
US12283506B2Apr 22, 2025

Humidity control device for equipment front end module of semiconductor processing or characterization tool

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12334373B2Jun 17, 2025

Apparatus and method for inspecting wafer carriers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12322628B2Jun 3, 2025

Apparatus and method for automated wafer carrier handling

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12282318B2Apr 22, 2025

Semiconductor wafer cooling

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11929271B2Mar 12, 2024

Apparatus and method for inspecting wafer carriers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11915958B2Feb 27, 2024

Apparatus and method for automated wafer carrier handling

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11768484B2Sep 26, 2023

Semiconductor wafer cooling

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12153433B2Nov 26, 2024

Systems and methods for raised floor automated sensor vehicles

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11334080B2May 17, 2022

Systems and methods for raised floor automated sensor vehicles

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12400313B2Aug 26, 2025

Optical inspection of a wafer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11954841B2Apr 9, 2024

Optical inspection of a wafer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11651981B2May 16, 2023

Method and system for map-free inspection of semiconductor devices

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11120539B2Sep 14, 2021

Topological scanning method and system

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12543526B2Feb 3, 2026

Fully automated wafer debonding system and method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12346034B2Jul 1, 2025

Method and system of removing particles from pellicle

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12125727B2Oct 22, 2024

Wafer transfer system and a method for transporting wafers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations56
US11152238B2Oct 19, 2021

Semiconductor processing stage profiler jig

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10971386B1Apr 6, 2021

Device positioning using sensors

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US12165906B2Dec 10, 2024

Apparatus and methods for handling semiconductor part carriers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49

WU HSIU-WU

1 patent