P

Inventor

KOHNO RYUJI

JP86 patents
⚠️ This page may combine multiple inventors who share the name “KOHNO RYUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI LTD

23 patents
US5608265AMar 4, 1997

Encapsulated semiconductor device package having holes for electrically conductive material

HITACHI LTD567 citations99
US5569960AOct 29, 1996

Electronic component, electronic component assembly and electronic component unit

HITACHI LTD105 citations98
US5539250AJul 23, 1996

Plastic-molded-type semiconductor device

HITACHI LTD63 citations96
US5357139AOct 18, 1994

Plastic encapsulated semiconductor device and lead frame

HITACHI LTD58 citations96
US5347429ASep 13, 1994

Plastic-molded-type semiconductor device

HITACHI LTD86 citations96
US5159434AOct 27, 1992

Semiconductor device having a particular chip pad structure

HITACHI LTD68 citations96
US6492829B1Dec 10, 2002

Contactor for inspection

HITACHI LTD18 citations93
US6130112AOct 10, 2000

Semiconductor device

HITACHI LTD20 citations93
US6049128AApr 11, 2000

Semiconductor device

HITACHI LTD21 citations93
US5635756AJun 3, 1997

Semiconductor device, lead frame therefor and memory card to provide a thin structure

HITACHI LTD18 citations93
US5391916AFeb 21, 1995

Resin sealed type semiconductor device

HITACHI LTD21 citations93
US5296737AMar 22, 1994

Semiconductor device with a plurality of face to face chips

HITACHI LTD34 citations93
US5293068AMar 8, 1994

Semiconductor device

HITACHI LTD35 citations93
US5194935AMar 16, 1993

Plastic encapsulated semiconductor device and structure for mounting the same devices having particular radiating fin structure

HITACHI LTD23 citations93
US6566150B2May 20, 2003

Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step

HITACHI LTD15 citations92
US6531327B2Mar 11, 2003

Method for manufacturing semiconductor device utilizing semiconductor testing equipment

HITACHI LTD17 citations92
US6507204B1Jan 14, 2003

Semiconductor testing equipment with probe formed on a cantilever of a substrate

HITACHI LTD40 citations92
US6455335B1Sep 24, 2002

Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step

HITACHI LTD17 citations92
US6358762B1Mar 19, 2002

Manufacture method for semiconductor inspection apparatus

HITACHI LTD38 citations92
US6496023B1Dec 17, 2002

Semiconductor-device inspecting apparatus and a method for manufacturing the same

HITACHI LTD20 citations91
US5295045AMar 15, 1994

Plastic-molded-type semiconductor device and producing method therefor

HITACHI LTD23 citations91
US6197603B1Mar 6, 2001

Semiconductor device and manufacturing method thereof including a probe test step and a burn-in test step

HITACHI LTD12 citations82
US6955870B2Oct 18, 2005

Method of manufacturing a semiconductor device

HITACHI LTD6 citations74

SONY CORP

8 patents

TOSHIBA TEC KK

4 patents

HONDA MOTOR CO LTD

3 patents

RENESAS TECH CORP

3 patents

FURUKAWA ELECTRIC CO LTD

2 patents

NAT INST INF & COMM TECH

2 patents

HITACHI CONSTRUCTION MACH CO

1 patent

PANASONIC CORP

1 patent

SOKKISHA

1 patent

SHIKAMA MAHITO

1 patent

KOHNO RYUJI

1 patent

Showing the top 50 of 86 patents by PatentIndex Score.