Inventor
CHUDZIK MICHAEL P
US116 patents
⚠️ This page may combine multiple inventors who share the name “CHUDZIK MICHAEL P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
29 patentsUS7622341B2Nov 24, 2009
Sige channel epitaxial development for high-k PFET manufacturability
IBM121 citations97
US6930060B2Aug 16, 2005
Method for forming a uniform distribution of nitrogen in silicon oxynitride gate dielectric
IBM90 citations94
US8373239B2Feb 12, 2013
Structure and method for replacement gate MOSFET with self-aligned contact using sacrificial mandrel dielectric
IBM31 citations93
US7838908B2Nov 23, 2010
Semiconductor device having dual metal gates and method of manufacture
IBM28 citations93
US7741188B2Jun 22, 2010
Deep trench (DT) metal-insulator-metal (MIM) capacitor
IBM41 citations93
US7732872B2Jun 8, 2010
Integration scheme for multiple metal gate work function structures
IBM24 citations93
US7446380B2Nov 4, 2008
Stabilization of flatband voltages and threshold voltages in hafnium oxide based silicon transistors for CMOS
IBM20 citations93
US7186625B2Mar 6, 2007
High density MIMCAP with a unit repeatable structure
IBM23 citations93
US8354309B2Jan 15, 2013
Method of providing threshold voltage adjustment through gate dielectric stack modification
IBM24 citations92
US7863126B2Jan 4, 2011
Fabrication of a CMOS structure with a high-k dielectric layer oxidizing an aluminum layer in PFET region
IBM25 citations92
US7750418B2Jul 6, 2010
Introduction of metal impurity to change workfunction of conductive electrodes
IBM18 citations92
US7569466B2Aug 4, 2009
Dual metal gate self-aligned integration
IBM19 citations92
US7504700B2Mar 17, 2009
Method of forming an ultra-thin [[HfSiO]] metal silicate film for high performance CMOS applications and semiconductor structure formed in said method
IBM26 citations92
US6936512B2Aug 30, 2005
Semiconductor method and structure for simultaneously forming a trench capacitor dielectric and trench sidewall device dielectric
IBM23 citations92
US6555430B1Apr 29, 2003
Process flow for capacitance enhancement in a DRAM trench
IBM44 citations92
US8952460B2Feb 10, 2015
Germanium oxide free atomic layer deposition of silicon oxide and high-k gate dielectric on germanium containing channel for CMOS devices
IBM7 citations84
US8383483B2Feb 26, 2013
High performance CMOS circuits, and methods for fabricating same
IBM10 citations84
US8030716B2Oct 4, 2011
Self-aligned CMOS structure with dual workfunction
IBM8 citations84
US8021939B2Sep 20, 2011
High-k dielectric and metal gate stack with minimal overlap with isolation region and related methods
IBM9 citations84
US7947549B2May 24, 2011
Gate effective-workfunction modification for CMOS
IBM7 citations84
US7872317B2Jan 18, 2011
Dual metal gate self-aligned integration
IBM10 citations84
US7863123B2Jan 4, 2011
Direct contact between high-κ/metal gate and wiring process flow
IBM8 citations84
US7754594B1Jul 13, 2010
Method for tuning the threshold voltage of a metal gate and high-k device
IBM17 citations84
US7611979B2Nov 3, 2009
Metal gates with low charge trapping and enhanced dielectric reliability characteristics for high-k gate dielectric stacks
IBM8 citations84
US7425497B2Sep 16, 2008
Introduction of metal impurity to change workfunction of conductive electrodes
IBM14 citations84
US8053306B2Nov 8, 2011
PFET with tailored dielectric and related methods and integrated circuit
IBM8 citations83
US7943457B2May 17, 2011
Dual metal and dual dielectric integration for metal high-k FETs
IBM13 citations82
US6541331B2Apr 1, 2003
Method of manufacturing high dielectric constant material
IBM12 citations74
US9373501B2Jun 21, 2016
Hydroxyl group termination for nucleation of a dielectric metallic oxide
IBM3 citations73
GLOBALFOUNDRIES INC
5 patentsUS9437496B1Sep 6, 2016
Merged source drain epitaxy
GLOBALFOUNDRIES INC26 citations94
US9577100B2Feb 21, 2017
FinFET and nanowire semiconductor devices with suspended channel regions and gate structures surrounding the suspended channel regions
GLOBALFOUNDRIES INC17 citations84
US9679810B1Jun 13, 2017
Integrated circuit having improved electromigration performance and method of forming same
GLOBALFOUNDRIES INC18 citations83
US9627508B2Apr 18, 2017
Replacement channel TFET
GLOBALFOUNDRIES INC3 citations73
US9293461B2Mar 22, 2016
Replacement metal gate structures for effective work function control
GLOBALFOUNDRIES INC4 citations73
CHUDZIK MICHAEL P
3 patentsUS8138037B2Mar 20, 2012
Method and structure for gate height scaling with high-k/metal gate technology
CHUDZIK MICHAEL P43 citations98
US8227870B2Jul 24, 2012
Method and structure for gate height scaling with high-k/metal gate technology
CHUDZIK MICHAEL P7 citations84
US8901706B2Dec 2, 2014
Thermally stable high-K tetragonal HFO2 layer within high aspect ratio deep trenches
CHUDZIK MICHAEL P4 citations73
LI ZHENGWEN
3 patentsUS8232148B2Jul 31, 2012
Structure and method to make replacement metal gate and contact metal
LI ZHENGWEN19 citations92
US8759172B2Jun 24, 2014
Etch stop layer formation in metal gate process
LI ZHENGWEN7 citations84
US8916435B2Dec 23, 2014
Self-aligned bottom plate for metal high-K dielectric metal insulator metal (MIM) embedded dynamic random access memory
LI ZHENGWEN4 citations73
ANDO TAKASHI
2 patentsUNIV CHICAGO
1 patentKWON UNOH
1 patentBEDELL STEPHEN W
1 patentINFINEON TECHNOLOGIES CORP
1 patentKIM BYEONG Y
1 patentGREENE BRIAN J
1 patentBREIL NICOLAS
1 patentADAMS CHARLOTTE DEWAN
1 patentShowing the top 50 of 116 patents by PatentIndex Score.