Inventor
DIVAKARUNI RAMACHANDRA
US252 patents
⚠️ This page may combine multiple inventors who share the name “DIVAKARUNI RAMACHANDRA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
49 patentsUS7683428B2Mar 23, 2010
Vertical Fin-FET MOS devices
IBM221 citations99
US7470570B2Dec 30, 2008
Process for fabrication of FinFETs
IBM138 citations99
US6590259B2Jul 8, 2003
Semiconductor device of an embedded DRAM on SOI substrate
IBM177 citations99
US6440872B1Aug 27, 2002
Method for hybrid DRAM cell utilizing confined strap isolation
IBM166 citations99
US6350653B1Feb 26, 2002
Embedded DRAM on silicon-on-insulator substrate
IBM236 citations99
US6943409B1Sep 13, 2005
Trench optical device
IBM97 citations98
US6797553B2Sep 28, 2004
Method for making multiple threshold voltage FET using multiple work-function gate materials
IBM119 citations98
US6492211B1Dec 10, 2002
Method for novel SOI DRAM BICMOS NPN
IBM144 citations98
US6406962B1Jun 18, 2002
Vertical trench-formed dual-gate FET device structure and method for creation
IBM139 citations98
US6630379B2Oct 7, 2003
Method of manufacturing 6F2 trench capacitor DRAM cell having vertical MOSFET and 3F bitline pitch
IBM62 citations96
US6518641B2Feb 11, 2003
Deep slit isolation with controlled void
IBM52 citations96
US6440793B1Aug 27, 2002
Vertical MOSFET
IBM70 citations96
US6429068B1Aug 6, 2002
Structure and method of fabricating embedded vertical DRAM arrays with silicided bitline and polysilicon interconnect
IBM62 citations96
US6426526B1Jul 30, 2002
Single sided buried strap
IBM53 citations96
US6396121B1May 28, 2002
Structures and methods of anti-fuse formation in SOI
IBM73 citations96
US6339241B1Jan 15, 2002
Structure and process for 6F2 trench capacitor DRAM cell with vertical MOSFET and 3F bitline pitch
IBM73 citations96
US6287913B1Sep 11, 2001
Double polysilicon process for providing single chip high performance logic and compact embedded memory structure
IBM76 citations96
US6281064B1Aug 28, 2001
Method for providing dual work function doping and protective insulating cap
IBM61 citations96
US6258659B1Jul 10, 2001
Embedded vertical DRAM cells and dual workfunction logic gates
IBM56 citations96
US6150212ANov 21, 2000
Shallow trench isolation method utilizing combination of spacer and fill
IBM75 citations96
US9484267B1Nov 1, 2016
Stacked nanowire devices
IBM35 citations94
US9735269B1Aug 15, 2017
Integrated strained stacked nanosheet FET
IBM12 citations93
US9484347B1Nov 1, 2016
FinFET CMOS with Si NFET and SiGe PFET
IBM22 citations93
US8987823B2Mar 24, 2015
Method and structure for forming a localized SOI finFET
IBM20 citations93
US8928086B2Jan 6, 2015
Strained finFET with an electrically isolated channel
IBM19 citations93
US8017997B2Sep 13, 2011
Vertical metal-insulator-metal (MIM) capacitor using gate stack, gate spacer and contact via
IBM21 citations93
US7790530B2Sep 7, 2010
Dual port gain cell with side and top gated read transistor
IBM19 citations93
US7732872B2Jun 8, 2010
Integration scheme for multiple metal gate work function structures
IBM24 citations93
US7682859B2Mar 23, 2010
Patterned strained semiconductor substrate and device
IBM14 citations93
US7615816B2Nov 10, 2009
Buried plate structure for vertical dram devices
IBM14 citations93
US7459743B2Dec 2, 2008
Dual port gain cell with side and top gated read transistor
IBM27 citations93
US7439128B2Oct 21, 2008
Method of creating deep trench capacitor using a P+ metal electrode
IBM22 citations93
US7384829B2Jun 10, 2008
Patterned strained semiconductor substrate and device
IBM14 citations93
US7226816B2Jun 5, 2007
Method of forming connection and anti-fuse in layered substrate such as SOI
IBM15 citations93
US7223653B2May 29, 2007
Process for forming a buried plate
IBM31 citations93
US7195972B2Mar 27, 2007
Trench capacitor DRAM cell using buried oxide as array top oxide
IBM20 citations93
US7193262B2Mar 20, 2007
Low-cost deep trench decoupling capacitor device and process of manufacture
IBM26 citations93
US7132324B2Nov 7, 2006
SOI device with different crystallographic orientations
IBM17 citations93
US7129130B2Oct 31, 2006
Out of the box vertical transistor for eDRAM on SOI
IBM25 citations93
US7122437B2Oct 17, 2006
Deep trench capacitor with buried plate electrode and isolation collar
IBM23 citations93
US7037794B2May 2, 2006
Raised STI process for multiple gate ox and sidewall protection on strained Si/SGOI structure with elevated source/drain
IBM18 citations93
US7009237B2Mar 7, 2006
Out of the box vertical transistor for eDRAM on SOI
IBM23 citations93
US6969648B2Nov 29, 2005
Method for forming buried plate of trench capacitor
IBM22 citations93
US6909137B2Jun 21, 2005
Method of creating deep trench capacitor using a P+ metal electrode
IBM20 citations93
US6833305B2Dec 21, 2004
Vertical DRAM punchthrough stop self-aligned to storage trench
IBM19 citations93
US6787838B1Sep 7, 2004
Trench capacitor DRAM cell using buried oxide as array top oxide
IBM17 citations93
US6777737B2Aug 17, 2004
Vertical DRAM punchthrough stop self-aligned to storage trench
IBM21 citations93
US6759702B2Jul 6, 2004
Memory cell with vertical transistor and trench capacitor with reduced burried strap
IBM40 citations93
US6750097B2Jun 15, 2004
Method of fabricating a patterened SOI embedded DRAM/eDRAM having a vertical device cell and device formed thereby
IBM21 citations93
INFINEON TECHNOLOGIES CORP
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