P

Inventor

DIVAKARUNI RAMACHANDRA

US252 patents
⚠️ This page may combine multiple inventors who share the name “DIVAKARUNI RAMACHANDRA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

49 patents
US7683428B2Mar 23, 2010

Vertical Fin-FET MOS devices

IBM221 citations99
US7470570B2Dec 30, 2008

Process for fabrication of FinFETs

IBM138 citations99
US6590259B2Jul 8, 2003

Semiconductor device of an embedded DRAM on SOI substrate

IBM177 citations99
US6440872B1Aug 27, 2002

Method for hybrid DRAM cell utilizing confined strap isolation

IBM166 citations99
US6350653B1Feb 26, 2002

Embedded DRAM on silicon-on-insulator substrate

IBM236 citations99
US6943409B1Sep 13, 2005

Trench optical device

IBM97 citations98
US6797553B2Sep 28, 2004

Method for making multiple threshold voltage FET using multiple work-function gate materials

IBM119 citations98
US6492211B1Dec 10, 2002

Method for novel SOI DRAM BICMOS NPN

IBM144 citations98
US6406962B1Jun 18, 2002

Vertical trench-formed dual-gate FET device structure and method for creation

IBM139 citations98
US6630379B2Oct 7, 2003

Method of manufacturing 6F2 trench capacitor DRAM cell having vertical MOSFET and 3F bitline pitch

IBM62 citations96
US6518641B2Feb 11, 2003

Deep slit isolation with controlled void

IBM52 citations96
US6440793B1Aug 27, 2002

Vertical MOSFET

IBM70 citations96
US6429068B1Aug 6, 2002

Structure and method of fabricating embedded vertical DRAM arrays with silicided bitline and polysilicon interconnect

IBM62 citations96
US6426526B1Jul 30, 2002

Single sided buried strap

IBM53 citations96
US6396121B1May 28, 2002

Structures and methods of anti-fuse formation in SOI

IBM73 citations96
US6339241B1Jan 15, 2002

Structure and process for 6F2 trench capacitor DRAM cell with vertical MOSFET and 3F bitline pitch

IBM73 citations96
US6287913B1Sep 11, 2001

Double polysilicon process for providing single chip high performance logic and compact embedded memory structure

IBM76 citations96
US6281064B1Aug 28, 2001

Method for providing dual work function doping and protective insulating cap

IBM61 citations96
US6258659B1Jul 10, 2001

Embedded vertical DRAM cells and dual workfunction logic gates

IBM56 citations96
US6150212ANov 21, 2000

Shallow trench isolation method utilizing combination of spacer and fill

IBM75 citations96
US9484267B1Nov 1, 2016

Stacked nanowire devices

IBM35 citations94
US9735269B1Aug 15, 2017

Integrated strained stacked nanosheet FET

IBM12 citations93
US9484347B1Nov 1, 2016

FinFET CMOS with Si NFET and SiGe PFET

IBM22 citations93
US8987823B2Mar 24, 2015

Method and structure for forming a localized SOI finFET

IBM20 citations93
US8928086B2Jan 6, 2015

Strained finFET with an electrically isolated channel

IBM19 citations93
US8017997B2Sep 13, 2011

Vertical metal-insulator-metal (MIM) capacitor using gate stack, gate spacer and contact via

IBM21 citations93
US7790530B2Sep 7, 2010

Dual port gain cell with side and top gated read transistor

IBM19 citations93
US7732872B2Jun 8, 2010

Integration scheme for multiple metal gate work function structures

IBM24 citations93
US7682859B2Mar 23, 2010

Patterned strained semiconductor substrate and device

IBM14 citations93
US7615816B2Nov 10, 2009

Buried plate structure for vertical dram devices

IBM14 citations93
US7459743B2Dec 2, 2008

Dual port gain cell with side and top gated read transistor

IBM27 citations93
US7439128B2Oct 21, 2008

Method of creating deep trench capacitor using a P+ metal electrode

IBM22 citations93
US7384829B2Jun 10, 2008

Patterned strained semiconductor substrate and device

IBM14 citations93
US7226816B2Jun 5, 2007

Method of forming connection and anti-fuse in layered substrate such as SOI

IBM15 citations93
US7223653B2May 29, 2007

Process for forming a buried plate

IBM31 citations93
US7195972B2Mar 27, 2007

Trench capacitor DRAM cell using buried oxide as array top oxide

IBM20 citations93
US7193262B2Mar 20, 2007

Low-cost deep trench decoupling capacitor device and process of manufacture

IBM26 citations93
US7132324B2Nov 7, 2006

SOI device with different crystallographic orientations

IBM17 citations93
US7129130B2Oct 31, 2006

Out of the box vertical transistor for eDRAM on SOI

IBM25 citations93
US7122437B2Oct 17, 2006

Deep trench capacitor with buried plate electrode and isolation collar

IBM23 citations93
US7037794B2May 2, 2006

Raised STI process for multiple gate ox and sidewall protection on strained Si/SGOI structure with elevated source/drain

IBM18 citations93
US7009237B2Mar 7, 2006

Out of the box vertical transistor for eDRAM on SOI

IBM23 citations93
US6969648B2Nov 29, 2005

Method for forming buried plate of trench capacitor

IBM22 citations93
US6909137B2Jun 21, 2005

Method of creating deep trench capacitor using a P+ metal electrode

IBM20 citations93
US6833305B2Dec 21, 2004

Vertical DRAM punchthrough stop self-aligned to storage trench

IBM19 citations93
US6787838B1Sep 7, 2004

Trench capacitor DRAM cell using buried oxide as array top oxide

IBM17 citations93
US6777737B2Aug 17, 2004

Vertical DRAM punchthrough stop self-aligned to storage trench

IBM21 citations93
US6759702B2Jul 6, 2004

Memory cell with vertical transistor and trench capacitor with reduced burried strap

IBM40 citations93
US6750097B2Jun 15, 2004

Method of fabricating a patterened SOI embedded DRAM/eDRAM having a vertical device cell and device formed thereby

IBM21 citations93

INFINEON TECHNOLOGIES CORP

1 patent

Showing the top 50 of 252 patents by PatentIndex Score.