Inventor · disambiguated record
Chi-Chin Liao
Also filed as: LIAO CHI-CHIN
2 granted patents·11 citations·filing 2009–2009
56Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0182US8053276B2Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packagesSANDISK TECHNOLOGIES INC·Filed 2009·Granted Nov 8, 2011·10 cites·7 claims
- 0253US8110439B2Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packagesYU CHEEMAN·Filed 2009·Granted Feb 7, 2012·1 cites·10 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →