P

Inventor

YANG HAINING S

US139 patents
⚠️ This page may combine multiple inventors who share the name “YANG HAINING S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

44 patents
US6891192B2May 10, 2005

Structure and method of making strained semiconductor CMOS transistors having lattice-mismatched semiconductor regions underlying source and drain regions

IBM179 citations99
US6881635B1Apr 19, 2005

Strained silicon NMOS devices with embedded source/drain

IBM176 citations99
US7767099B2Aug 3, 2010

Sub-lithographic interconnect patterning using self-assembling polymers

IBM73 citations98
US7625790B2Dec 1, 2009

FinFET with sublithographic fin width

IBM120 citations98
US7557424B2Jul 7, 2009

Reversible electric fuse and antifuse structures for semiconductor devices

IBM75 citations98
US7791109B2Sep 7, 2010

Metal silicide alloy local interconnect

IBM109 citations97
US7002209B2Feb 21, 2006

MOSFET structure with high mechanical stress in the channel

IBM61 citations96
US6946709B2Sep 20, 2005

Complementary transistors having different source and drain extension spacing controlled by different spacer sizes

IBM44 citations96
US6906360B2Jun 14, 2005

Structure and method of making strained channel CMOS transistors having lattice-mismatched epitaxial extension and source and drain regions

IBM55 citations94
US7973409B2Jul 5, 2011

Hybrid interconnect structure for performance improvement and reliability enhancement

IBM24 citations93
US7867832B2Jan 11, 2011

Electrical fuse and method of making

IBM31 citations93
US7781847B2Aug 24, 2010

Device patterned with sub-lithographic features with variable widths

IBM35 citations93
US7737501B2Jun 15, 2010

FinFET SRAM with asymmetric gate and method of manufacture thereof

IBM33 citations93
US7732872B2Jun 8, 2010

Integration scheme for multiple metal gate work function structures

IBM24 citations93
US7696085B2Apr 13, 2010

Dual damascene metal interconnect structure having a self-aligned via

IBM25 citations93
US7635620B2Dec 22, 2009

Semiconductor device structure having enhanced performance FET device

IBM16 citations93
US7485508B2Feb 3, 2009

Two-sided semiconductor-on-insulator structures and methods of manufacturing the same

IBM28 citations93
US7361539B2Apr 22, 2008

Dual stress liner

IBM19 citations93
US7118999B2Oct 10, 2006

Method and apparatus to increase strain effect in a transistor channel

IBM20 citations93
US7291528B2Nov 6, 2007

Method of making strained semiconductor transistors having lattice-mismatched semiconductor regions underlying source and drain regions

IBM16 citations92
US7098536B2Aug 29, 2006

Structure for strained channel field effect transistor pair having a member and a contact via

IBM31 citations92
US6984564B1Jan 10, 2006

Structure and method to improve SRAM stability without increasing cell area or off current

IBM39 citations91
US8796854B2Aug 5, 2014

Hybrid interconnect structure for performance improvement and reliability enhancement

IBM6 citations84
US8361704B2Jan 29, 2013

Method for reducing tip-to-tip spacing between lines

IBM8 citations84
US7964487B2Jun 21, 2011

Carrier mobility enhanced channel devices and method of manufacture

IBM12 citations84
US7960223B2Jun 14, 2011

Structure and method to integrate dual silicide with dual stress liner to improve CMOS performance

IBM9 citations84
US7947557B2May 24, 2011

Heterojunction tunneling field effect transistors, and methods for fabricating the same

IBM7 citations84
US7859044B2Dec 28, 2010

Partially gated FINFET with gate dielectric on only one sidewall

IBM11 citations84
US7851885B2Dec 14, 2010

Methods and systems involving electrically programmable fuses

IBM11 citations84
US7785937B2Aug 31, 2010

Electrical fuse having sublithographic cavities thereupon

IBM9 citations84
US7777297B2Aug 17, 2010

Non-planar fuse structure including angular bend

IBM9 citations84
US7741721B2Jun 22, 2010

Electrical fuses and resistors having sublithographic dimensions

IBM14 citations84
US7709317B2May 4, 2010

Method to increase strain enhancement with spacerless FET and dual liner process

IBM15 citations84
US7666721B2Feb 23, 2010

SOI substrates and SOI devices, and methods for forming the same

IBM10 citations84
US7635899B2Dec 22, 2009

Structure and method to form improved isolation in a semiconductor device

IBM14 citations84
US7569489B2Aug 4, 2009

High performance 3D FET structures, and methods for forming the same using preferential crystallographic etching

IBM12 citations84
US7566949B2Jul 28, 2009

High performance 3D FET structures, and methods for forming the same using preferential crystallographic etching

IBM8 citations84
US7528451B2May 5, 2009

CMOS gate conductor having cross-diffusion barrier

IBM9 citations84
US7504336B2Mar 17, 2009

Methods for forming CMOS devices with intrinsically stressed metal silicide layers

IBM16 citations84
US7491585B2Feb 17, 2009

Electrical fuse and method of making

IBM11 citations84
US7482652B1Jan 27, 2009

Multiwalled carbon nanotube memory device

IBM14 citations84
US7470943B2Dec 30, 2008

High performance MOSFET comprising a stressed gate metal silicide layer and method of fabricating the same

IBM11 citations84
US7452758B2Nov 18, 2008

Process for making FinFET device with body contact and buried oxide junction isolation

IBM9 citations84
US7432553B2Oct 7, 2008

Structure and method to optimize strain in CMOSFETs

IBM13 citations84

CHEN XIANGDONG

2 patents

LI WAI-KIN

1 patent

HEYMANN OMER

1 patent

DYER THOMAS W

1 patent

CHENG KANGGUO

1 patent

Showing the top 50 of 139 patents by PatentIndex Score.