Inventor
YANG HAINING S
US139 patents
⚠️ This page may combine multiple inventors who share the name “YANG HAINING S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
44 patentsUS6891192B2May 10, 2005
Structure and method of making strained semiconductor CMOS transistors having lattice-mismatched semiconductor regions underlying source and drain regions
IBM179 citations99
US6881635B1Apr 19, 2005
Strained silicon NMOS devices with embedded source/drain
IBM176 citations99
US7767099B2Aug 3, 2010
Sub-lithographic interconnect patterning using self-assembling polymers
IBM73 citations98
US7625790B2Dec 1, 2009
FinFET with sublithographic fin width
IBM120 citations98
US7557424B2Jul 7, 2009
Reversible electric fuse and antifuse structures for semiconductor devices
IBM75 citations98
US7791109B2Sep 7, 2010
Metal silicide alloy local interconnect
IBM109 citations97
US7002209B2Feb 21, 2006
MOSFET structure with high mechanical stress in the channel
IBM61 citations96
US6946709B2Sep 20, 2005
Complementary transistors having different source and drain extension spacing controlled by different spacer sizes
IBM44 citations96
US6906360B2Jun 14, 2005
Structure and method of making strained channel CMOS transistors having lattice-mismatched epitaxial extension and source and drain regions
IBM55 citations94
US7973409B2Jul 5, 2011
Hybrid interconnect structure for performance improvement and reliability enhancement
IBM24 citations93
US7867832B2Jan 11, 2011
Electrical fuse and method of making
IBM31 citations93
US7781847B2Aug 24, 2010
Device patterned with sub-lithographic features with variable widths
IBM35 citations93
US7737501B2Jun 15, 2010
FinFET SRAM with asymmetric gate and method of manufacture thereof
IBM33 citations93
US7732872B2Jun 8, 2010
Integration scheme for multiple metal gate work function structures
IBM24 citations93
US7696085B2Apr 13, 2010
Dual damascene metal interconnect structure having a self-aligned via
IBM25 citations93
US7635620B2Dec 22, 2009
Semiconductor device structure having enhanced performance FET device
IBM16 citations93
US7485508B2Feb 3, 2009
Two-sided semiconductor-on-insulator structures and methods of manufacturing the same
IBM28 citations93
US7361539B2Apr 22, 2008
Dual stress liner
IBM19 citations93
US7118999B2Oct 10, 2006
Method and apparatus to increase strain effect in a transistor channel
IBM20 citations93
US7291528B2Nov 6, 2007
Method of making strained semiconductor transistors having lattice-mismatched semiconductor regions underlying source and drain regions
IBM16 citations92
US7098536B2Aug 29, 2006
Structure for strained channel field effect transistor pair having a member and a contact via
IBM31 citations92
US6984564B1Jan 10, 2006
Structure and method to improve SRAM stability without increasing cell area or off current
IBM39 citations91
US8796854B2Aug 5, 2014
Hybrid interconnect structure for performance improvement and reliability enhancement
IBM6 citations84
US8361704B2Jan 29, 2013
Method for reducing tip-to-tip spacing between lines
IBM8 citations84
US7964487B2Jun 21, 2011
Carrier mobility enhanced channel devices and method of manufacture
IBM12 citations84
US7960223B2Jun 14, 2011
Structure and method to integrate dual silicide with dual stress liner to improve CMOS performance
IBM9 citations84
US7947557B2May 24, 2011
Heterojunction tunneling field effect transistors, and methods for fabricating the same
IBM7 citations84
US7859044B2Dec 28, 2010
Partially gated FINFET with gate dielectric on only one sidewall
IBM11 citations84
US7851885B2Dec 14, 2010
Methods and systems involving electrically programmable fuses
IBM11 citations84
US7785937B2Aug 31, 2010
Electrical fuse having sublithographic cavities thereupon
IBM9 citations84
US7777297B2Aug 17, 2010
Non-planar fuse structure including angular bend
IBM9 citations84
US7741721B2Jun 22, 2010
Electrical fuses and resistors having sublithographic dimensions
IBM14 citations84
US7709317B2May 4, 2010
Method to increase strain enhancement with spacerless FET and dual liner process
IBM15 citations84
US7666721B2Feb 23, 2010
SOI substrates and SOI devices, and methods for forming the same
IBM10 citations84
US7635899B2Dec 22, 2009
Structure and method to form improved isolation in a semiconductor device
IBM14 citations84
US7569489B2Aug 4, 2009
High performance 3D FET structures, and methods for forming the same using preferential crystallographic etching
IBM12 citations84
US7566949B2Jul 28, 2009
High performance 3D FET structures, and methods for forming the same using preferential crystallographic etching
IBM8 citations84
US7528451B2May 5, 2009
CMOS gate conductor having cross-diffusion barrier
IBM9 citations84
US7504336B2Mar 17, 2009
Methods for forming CMOS devices with intrinsically stressed metal silicide layers
IBM16 citations84
US7491585B2Feb 17, 2009
Electrical fuse and method of making
IBM11 citations84
US7482652B1Jan 27, 2009
Multiwalled carbon nanotube memory device
IBM14 citations84
US7470943B2Dec 30, 2008
High performance MOSFET comprising a stressed gate metal silicide layer and method of fabricating the same
IBM11 citations84
US7452758B2Nov 18, 2008
Process for making FinFET device with body contact and buried oxide junction isolation
IBM9 citations84
US7432553B2Oct 7, 2008
Structure and method to optimize strain in CMOSFETs
IBM13 citations84
CHEN XIANGDONG
2 patentsLI WAI-KIN
1 patentHEYMANN OMER
1 patentDYER THOMAS W
1 patentCHENG KANGGUO
1 patentShowing the top 50 of 139 patents by PatentIndex Score.