Inventor
LIN CHUN-JUNG
TW50 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHUN-JUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MACRONIX INT CO LTD
12 patentsUS5880040AMar 9, 1999
Gate dielectric based on oxynitride grown in N2 O and annealed in NO
MACRONIX INT CO LTD285 citations97
US6576511B2Jun 10, 2003
Method for forming nitride read only memory
MACRONIX INT CO LTD148 citations95
US5889711AMar 30, 1999
Memory redundancy for high density memory
MACRONIX INT CO LTD29 citations91
US6397377B1May 28, 2002
Method of performing optical proximity corrections of a photo mask pattern by using a computer
MACRONIX INT CO LTD20 citations89
US6468869B1Oct 22, 2002
Method of fabricating mask read only memory
MACRONIX INT CO LTD9 citations73
US6440803B1Aug 27, 2002
Method of fabricating a mask ROM with raised bit-line on each buried bit-line
MACRONIX INT CO LTD10 citations73
US6942732B2Sep 13, 2005
Method for forming double density wordline
MACRONIX INT CO LTD2 citations63
US6599680B2Jul 29, 2003
Method for forming cells array of mask read only memory
MACRONIX INT CO LTD4 citations63
US6166943ADec 26, 2000
Method of forming a binary code of a ROM
MACRONIX INT CO LTD3 citations61
US6621129B1Sep 16, 2003
MROM memory cell structure for storing multi level bit information
MACRONIX INT CO LTD2 citations56
US6570235B2May 27, 2003
Cells array of mask read only memory
MACRONIX INT CO LTD1 citations52
US6521499B1Feb 18, 2003
Method for forming non-volatile memory with self-aligned contact
MACRONIX INT CO LTD0 citations42
WALTON ADVANCED ENG INC
7 patentsUS11869876B2Jan 9, 2024
Thinning system in package
WALTON ADVANCED ENG INC0 citations59
US11587854B2Feb 21, 2023
System in package
WALTON ADVANCED ENG INC0 citations59
US12568847B2Mar 3, 2026
Chip package and method of manufacturing the same
WALTON ADVANCED ENG INC0 citations50
US12532760B2Jan 20, 2026
Chip package unit, method of manufacturing the same, and package structure formed by stacking the same
WALTON ADVANCED ENG INC0 citations50
US12512448B2Dec 30, 2025
Multi-layer stacked chip package
WALTON ADVANCED ENG INC0 citations50
US12482771B2Nov 25, 2025
Chip package with higher bearing capacity in wire bonding
WALTON ADVANCED ENG INC0 citations50
US10269718B2Apr 23, 2019
Rectangular semiconductor package and a method of manufacturing the same
WALTON ADVANCED ENG INC0 citations41
CHUNG SHINE
5 patentsUS8223534B2Jul 17, 2012
Raising programming currents of magnetic tunnel junctions using word line overdrive and high-k metal gate
CHUNG SHINE35 citations92
US8451655B2May 28, 2013
MRAM cells and circuit for programming the same
CHUNG SHINE7 citations83
US8111544B2Feb 7, 2012
Programming MRAM cells using probability write
CHUNG SHINE6 citations83
US8270207B2Sep 18, 2012
Raising programming current of magnetic tunnel junctions by applying P-sub bias and adjusting threshold voltage
CHUNG SHINE2 citations63
US8879308B2Nov 4, 2014
Raising programming currents of magnetic tunnel junctions using word line overdrive and high-k metal gate
CHUNG SHINE0 citations51
TAIWAN SEMICONDUCTOR MFG
4 patentsUS7683447B2Mar 23, 2010
MRAM device with continuous MTJ tunnel layers
TAIWAN SEMICONDUCTOR MFG22 citations92
US8008702B2Aug 30, 2011
Multi-transistor non-volatile memory element
TAIWAN SEMICONDUCTOR MFG12 citations84
US7834410B2Nov 16, 2010
Spin torque transfer magnetic tunnel junction structure
TAIWAN SEMICONDUCTOR MFG4 citations63
US9379316B2Jun 28, 2016
Method of fabricating a magnetoresistive random access structure
TAIWAN SEMICONDUCTOR MFG1 citations52
TAIWAN SEMICONDUCTOR MFG CO LTD
4 patentsUS9852785B2Dec 26, 2017
Memories with metal-ferroelectric-semiconductor (MFS) transistors
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations84
US9767878B1Sep 19, 2017
Semiconductor memory device and method for controlling the same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US10665321B2May 26, 2020
Method for testing MRAM device and test apparatus thereof
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations72
US9412721B2Aug 9, 2016
Contactless communications using ferromagnetic material
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations62