Inventor
GU RUEI-TING
TW8 patents
⚠️ This page may combine multiple inventors who share the name “GU RUEI-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WALTON ADVANCED ENG INC
6 patentsUS11869876B2Jan 9, 2024
Thinning system in package
WALTON ADVANCED ENG INC0 citations59
US11587854B2Feb 21, 2023
System in package
WALTON ADVANCED ENG INC0 citations59
US12568847B2Mar 3, 2026
Chip package and method of manufacturing the same
WALTON ADVANCED ENG INC0 citations50
US12532760B2Jan 20, 2026
Chip package unit, method of manufacturing the same, and package structure formed by stacking the same
WALTON ADVANCED ENG INC0 citations50
US12512448B2Dec 30, 2025
Multi-layer stacked chip package
WALTON ADVANCED ENG INC0 citations50
US12482771B2Nov 25, 2025
Chip package with higher bearing capacity in wire bonding
WALTON ADVANCED ENG INC0 citations50