Inventor
TANOUE HAYATO
JP20 patents
Patents
20 patentsUS11450523B2Sep 20, 2022
Substrate processing system with eccentricity detection device and substrate processing method
TOKYO ELECTRON LTD6 citations73
US11752576B2Sep 12, 2023
Substrate processing system for removing peripheral portion of substrate, substrate processing method and computer readable recording medium thereof
TOKYO ELECTRON LTD2 citations71
US12512336B2Dec 30, 2025
Substrate processing method and substrate processing apparatus
TOKYO ELECTRON LTD0 citations61
US12327768B2Jun 10, 2025
Substrate processing system and substrate processing method
TOKYO ELECTRON LTD0 citations61
US12191149B2Jan 7, 2025
Substrate processing method and substrate processing system
TOKYO ELECTRON LTD0 citations61
US11450578B2Sep 20, 2022
Substrate processing system and substrate processing method
TOKYO ELECTRON LTD0 citations61
US12543522B2Feb 3, 2026
Manufacturing method of chip-attached substrate and substrate processing apparatus
TOKYO ELECTRON LTD0 citations60
US12381085B2Aug 5, 2025
Bonded substrate peripheral laser processing method and substrate processing apparatus thereof
TOKYO ELECTRON LTD0 citations60
US12322656B2Jun 3, 2025
Substrate laser processing method and substrate laser processing apparatus
TOKYO ELECTRON LTD0 citations60
US12300495B2May 13, 2025
Processing apparatus and processing method
TOKYO ELECTRON LTD0 citations51
US12525453B2Jan 13, 2026
Processing apparatus and processing method
TOKYO ELECTRON LTD0 citations50
US12397375B2Aug 26, 2025
Processing apparatus and processing method
TOKYO ELECTRON LTD0 citations50
US12377497B2Aug 5, 2025
Substrate processing apparatus and substrate processing method
TOKYO ELECTRON LTD0 citations50
US12255063B2Mar 18, 2025
Substrate processing system and substrate processing method
TOKYO ELECTRON LTD0 citations50
US12191168B2Jan 7, 2025
Laser processing device, laser processing system and laser processing method
TOKYO ELECTRON LTD0 citations50
US12087588B2Sep 10, 2024
Substrate processing apparatus and substrate processing method
TOKYO ELECTRON LTD0 citations50
US12076820B2Sep 3, 2024
Substrate processing apparatus and substrate processing method
TOKYO ELECTRON LTD0 citations50
US12070820B2Aug 27, 2024
Processing apparatus and processing method
TOKYO ELECTRON LTD0 citations50
US12142483B2Nov 12, 2024
Substrate processing apparatus and substrate processing method
TOKYO ELECTRON LTD0 citations49
US11969827B2Apr 30, 2024
Processing apparatus and processing method
TOKYO ELECTRON LTD0 citations48