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Inventor
HUANG CHE-HSUAN
TW
2 patents
Patents
2 patents
US10312408B2
Jun 4, 2019
Light emitting diode chip scale packaging structure and direct type backlight module
LEXTAR ELECTRONICS CORP
0 citations
33
US10141476B2
Nov 27, 2018
Light emitting diode chip scale packaging structure
LEXTAR ELECTRONICS CORP
0 citations
33