Inventor
KACKER KARAN
US9 patents
⚠️ This page may combine multiple inventors who share the name “KACKER KARAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KACKER KARAN
6 patentsUS8522430B2Sep 3, 2013
Clustered stacked vias for reliable electronic substrates
KACKER KARAN37 citations93
US8242593B2Aug 14, 2012
Clustered stacked vias for reliable electronic substrates
KACKER KARAN4 citations61
US9099458B2Aug 4, 2015
Construction of reliable stacked via in electronic substrates—vertical stiffness control method
KACKER KARAN0 citations51
US8866026B2Oct 21, 2014
Construction of reliable stacked via in electronic substrates—vertical stiffness control method
KACKER KARAN0 citations51
US8258410B2Sep 4, 2012
Construction of reliable stacked via in electronic substrates—vertical stiffness control method
KACKER KARAN0 citations51
US8206160B2Jun 26, 2012
Compliant off-chip interconnects for use in electronic packages
KACKER KARAN1 citations48