Inventor

MATSUI KOJI

JP53 patents

⚠️ This page may combine multiple inventors who share the name “MATSUI KOJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MATSUI KOJI

NEC CORP

Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device

Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device

Thin film capacitor formed in via

Interconnection structures and method of making same

Multilayer printed circuit board

Method of connecting an integrated circuit chip to a substrate

Anisotropic conductive material and method for connecting integrated circuit element by using the anisotropic conductive material

Method of bonding circuit boards

Method of bonding circuit boards

Semiconductor device with passivation layer of benzocyclobutene polymer and silicon powder

Liquid crystal device with benzocyclobutene alignment layer and protective coating for electrodes

Semiconductor package board using a metal base

Electronic device assembly and a method of connecting electronic devices constituting the same

Electronic device assembly and a method of connecting electronic devices constituting the same

Thin film resistor and method for forming the same

Method of thermocompression bonding a supporting substrate to a semiconductor bare chip

Method of manufacturing a tab semiconductor device

Semiconductor package board using a metal base

Thin-film resistor, wiring substrate, and method for manufacturing the same

Semiconductor carrier and method for manufacturing the same

Carrier film and process for producing the same

Method of forming electrically conductive wiring pattern

Multilayer wiring structure

Multilayer printed circuit board

Semiconductor package board using a metal base

Resin laminated wiring sheet, wiring structure using the same, and production method thereof

Alkali or acid corrodible organic or composite particles in resin matrix

Printed wiring board and method for preparing the same

Solder, and mounted components using the same

Supporting substrate for a semiconductor bare chip

Carrier film and process for producing the same

NIPPON KOKAN KK

Burner with a cylindrical body

Burner

Burner with a cylindrical body

Burner

Burner with a cylindrical body

Burner with a cylindrical body

TOSOH CORP

Zirconia fine powder and method for its production

Zirconia sintered body, process for production thereof, and application thereof

Optical fiber connector part and process for producing the same

Sintered body and method for producing the same

Sintered body, powder and method for producing the same

NITTO DENKO CORP

Electronic component

Electronic component unit

NITTO ELECTRIC IND CO

Method for production of a fluid separation module

TOSHIBA SOLUTIONS CORP

File system with file management function and file management method

OSAKA SHIPBUILDING

Apparatus for designing a coupler

NAKAJIMA YASUAKI

Throttle body configured to provide turbulent air flow to a combustion chamber of an engine, and engine including same

TOPPAN PRINTING CO LTD

Personal identification medium

DAIICHI JITSUGYO VISWILL CO LTD

Visual inspection system for annular product