P

Inventor

PARK DONG-GUN

KR133 patents
⚠️ This page may combine multiple inventors who share the name “PARK DONG-GUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

45 patents
US7670912B2Mar 2, 2010

Methods of fabricating multichannel metal oxide semiconductor (MOS) transistors

SAMSUNG ELECTRONICS CO LTD172 citations99
US7329580B2Feb 12, 2008

Method of fabricating a semiconductor device having self-aligned floating gate and related device

SAMSUNG ELECTRONICS CO LTD277 citations99
US7297600B2Nov 20, 2007

Methods of forming fin field effect transistors using oxidation barrier layers

SAMSUNG ELECTRONICS CO LTD135 citations99
US7368352B2May 6, 2008

Semiconductor devices having transistors with vertical channels and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD61 citations98
US7332386B2Feb 19, 2008

Methods of fabricating fin field transistors

SAMSUNG ELECTRONICS CO LTD56 citations98
US7323375B2Jan 29, 2008

Fin field effect transistor device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD108 citations98
US7002207B2Feb 21, 2006

Field effect transistors having multiple stacked channels

SAMSUNG ELECTRONICS CO LTD74 citations98
US7615429B2Nov 10, 2009

Methods of fabricating field effect transistors having multiple stacked channels

SAMSUNG ELECTRONICS CO LTD39 citations96
US7148527B2Dec 12, 2006

Semiconductor devices with enlarged recessed gate electrodes

SAMSUNG ELECTRONICS CO LTD54 citations96
US7317230B2Jan 8, 2008

Fin FET structure

SAMSUNG ELECTRONICS CO LTD75 citations95
US8815702B2Aug 26, 2014

Methods of manufacturing semiconductor devices having a support structure for an active layer pattern

SAMSUNG ELECTRONICS CO LTD13 citations93
US7514325B2Apr 7, 2009

Fin-FET having GAA structure and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD23 citations93
US7402493B2Jul 22, 2008

Method for forming non-volatile memory devices

SAMSUNG ELECTRONICS CO LTD35 citations93
US7396726B2Jul 8, 2008

Methods of fabricating surrounded-channel transistors with directionally etched gate or insulator formation regions

SAMSUNG ELECTRONICS CO LTD21 citations93
US7271456B2Sep 18, 2007

Semiconductor devices including stress inducing layers

SAMSUNG ELECTRONICS CO LTD19 citations93
US7247896B2Jul 24, 2007

Semiconductor devices having a field effect transistor and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD25 citations93
US7161206B2Jan 9, 2007

Non-volatile memory devices

SAMSUNG ELECTRONICS CO LTD33 citations93
US6881659B2Apr 19, 2005

Methods of forming self-aligned contact structures in semiconductor integrated circuit devices

SAMSUNG ELECTRONICS CO LTD28 citations93
US6649508B1Nov 18, 2003

Methods of forming self-aligned contact structures in semiconductor integrated circuit devices

SAMSUNG ELECTRONICS CO LTD39 citations93
US7977725B2Jul 12, 2011

Integrated circuit semiconductor device including stacked level transistors

SAMSUNG ELECTRONICS CO LTD20 citations92
US7781287B2Aug 24, 2010

Methods of manufacturing vertical channel semiconductor devices

SAMSUNG ELECTRONICS CO LTD14 citations92
US7781285B2Aug 24, 2010

Semiconductor device having vertical transistor and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD22 citations92
US7586149B2Sep 8, 2009

Circuit device including vertical transistors connected to buried bitlines and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD34 citations92
US7381601B2Jun 3, 2008

Methods of fabricating field effect transistors having multiple stacked channels

SAMSUNG ELECTRONICS CO LTD24 citations92
US7358142B2Apr 15, 2008

Method for forming a FinFET by a damascene process

SAMSUNG ELECTRONICS CO LTD29 citations92
US7348628B2Mar 25, 2008

Vertical channel semiconductor devices and methods of manufacturing the same

SAMSUNG ELECTRONICS CO LTD30 citations92
US7285466B2Oct 23, 2007

Methods of forming metal oxide semiconductor (MOS) transistors having three dimensional channels

SAMSUNG ELECTRONICS CO LTD28 citations92
US7177192B2Feb 13, 2007

Method of operating a flash memory device

SAMSUNG ELECTRONICS CO LTD37 citations92
US7122431B2Oct 17, 2006

Methods of fabrication metal oxide semiconductor (MOS) transistors having buffer regions below source and drain regions

SAMSUNG ELECTRONICS CO LTD20 citations92
US7071517B2Jul 4, 2006

Self-aligned semiconductor contact structures and methods for fabricating the same

SAMSUNG ELECTRONICS CO LTD28 citations92
US7056781B2Jun 6, 2006

Method of forming fin field effect transistor

SAMSUNG ELECTRONICS CO LTD51 citations92
US7026688B2Apr 11, 2006

Field effect transistors having multiple stacked channels

SAMSUNG ELECTRONICS CO LTD22 citations92
US6940129B2Sep 6, 2005

Double gate MOS transistors

SAMSUNG ELECTRONICS CO LTD20 citations92
US7531412B2May 12, 2009

Methods of manufacturing semiconductor memory devices including a vertical channel transistor

SAMSUNG ELECTRONICS CO LTD26 citations91
US7015106B2Mar 21, 2006

Double gate field effect transistor and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD35 citations91
US8039896B2Oct 18, 2011

Semiconductor memory device with vertical channel formed on semiconductor pillars

SAMSUNG ELECTRONICS CO LTD8 citations84
US8022457B2Sep 20, 2011

Semiconductor memory device having vertical channel transistor and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD13 citations84
US7804137B2Sep 28, 2010

Field effect transistor (FET) devices and methods of manufacturing FET devices

SAMSUNG ELECTRONICS CO LTD12 citations84
US7800172B2Sep 21, 2010

Methods of forming semiconductor devices having multiple channel MOS transistors and related intermediate structures

SAMSUNG ELECTRONICS CO LTD14 citations84
US7759198B2Jul 20, 2010

Method of forming semiconductor devices having a vertical channel transistor

SAMSUNG ELECTRONICS CO LTD8 citations84
US7566619B2Jul 28, 2009

Methods of forming integrated circuit devices having field effect transistors of different types in different device regions

SAMSUNG ELECTRONICS CO LTD12 citations84
US7528022B2May 5, 2009

Method of forming fin field effect transistor using damascene process

SAMSUNG ELECTRONICS CO LTD11 citations84
US7510932B2Mar 31, 2009

Semiconductor devices having a field effect transistor and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD8 citations84
US7511358B2Mar 31, 2009

Nonvolatile memory device having multi-bit storage and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD10 citations84
US7473963B2Jan 6, 2009

Metal oxide semiconductor (MOS) transistors having three dimensional channels

SAMSUNG ELECTRONICS CO LTD8 citations84

OH CHANG-WOO

4 patents

LEE JOO-YOUNG

1 patent

Showing the top 50 of 133 patents by PatentIndex Score.