P

Inventor

DUAN GANG

US108 patents
⚠️ This page may combine multiple inventors who share the name “DUAN GANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

15 patents
US11355438B2Jun 7, 2022

Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications

INTEL CORP6 citations86
US11521931B2Dec 6, 2022

Microelectronic structures including bridges

INTEL CORP7 citations84
US11990427B2May 21, 2024

Chiplet first architecture for die tiling applications

INTEL CORP2 citations73
US11973041B2Apr 30, 2024

Chiplet first architecture for die tiling applications

INTEL CORP2 citations73
US11769735B2Sep 26, 2023

Chiplet first architecture for die tiling applications

INTEL CORP1 citations73
US11088103B2Aug 10, 2021

First layer interconnect first on carrier approach for EMIB patch

INTEL CORP3 citations72
US10847471B2Nov 24, 2020

Dielectric filler material in conductive material that functions as fiducial for an electronic device

INTEL CORP2 citations68
US12476214B2Nov 18, 2025

Solder interconnect hierarchy for heterogeneous electronic device packaging

INTEL CORP0 citations62
US12456705B2Oct 28, 2025

First layer interconnect first on carrier approach for EMIB patch

INTEL CORP0 citations62
US12354992B2Jul 8, 2025

First layer interconnect first on carrier approach for EMIB patch

INTEL CORP0 citations62
US12308329B2May 20, 2025

Chiplet first architecture for die tiling applications

INTEL CORP0 citations62
US12230430B2Feb 18, 2025

Substrate embedded magnetic core inductors and method of making

INTEL CORP0 citations62
US12125793B2Oct 22, 2024

Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications

INTEL CORP0 citations62
US12087695B2Sep 10, 2024

Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications

INTEL CORP0 citations62
US11978685B2May 7, 2024

Glass core patch with in situ fabricated fan-out layer to enable die tiling applications

INTEL CORP1 citations62

FORTINET INC

10 patents

NEUVECTOR INC

8 patents

WEI SHAOHONG

3 patents

DANISCO US INC

3 patents

VALSPAR SOURCING INC

3 patents

DUAN GANG

3 patents

CALIFORNIA INST OF TECHN

2 patents

GENENCOR INT

1 patent

BERGSMA MARTIEN H

1 patent

BEIJING SIFANG AUTOMATION CO

1 patent

Showing the top 50 of 108 patents by PatentIndex Score.