Inventor · disambiguated record
Blaine J. Thurgood
Also filed as: THURGOOD BLAINE · THURGOOD BLAINE J
14 granted patents·2 pending applications·104 citations·filing 2002–2024
91Inventor score
Technology areasH10W
Top patents by PatentIndex Score
16 records- 0196US11410969B2Semiconductor device assemblies including multiple stacks of different semiconductor diesMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 9, 2022·4 cites·21 claims
- 0295US11961821B2Semiconductor device assemblies including multiple stacks of different semiconductor diesMICRON TECHNOLOGY INC·Filed 2022·Granted Apr 16, 2024·2 cites·20 claims
- 0394US10797020B2Semiconductor device assemblies including multiple stacks of different semiconductor diesMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 6, 2020·10 cites·13 claims
- 0484US12451463B2Semiconductor device assemblies including multiple stacks of different semiconductor diesMICRON TECHNOLOGY INC·Filed 2024·Granted Oct 21, 2025·0 cites·20 claims
- 0581US6696748B1Stress balanced semiconductor packages, method of fabrication and modified mold segmentMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 24, 2004·25 cites·22 claims
- 0675US7102217B2Interposer substrates with reinforced interconnect slots, and semiconductor die packages including sameMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 5, 2006·18 cites·46 claims
- 0770US6855574B2Stress balanced semiconductor packages, method of fabrication and modified mold segmentMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 15, 2005·13 cites·16 claims
- 0869US7078823B2Semiconductor die configured for use with interposer substrates having reinforced interconnect slotsMICRON TECHNOLOGY INC·Filed 2004·Granted Jul 18, 2006·13 cites·5 claims
- 0968US11842984B2Semiconductor device assemblies including stacked individual modulesMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 12, 2023·0 cites·20 claims
- 1065US7084489B2Computer system including at least one stress balanced semiconductor packageMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 1, 2006·10 cites·22 claims
- 1158US7573125B2Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methodsMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 11, 2009·1 cites·30 claims
- 1258US6879050B2Packaged microelectronic devices and methods for packaging microelectronic devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 12, 2005·8 cites·69 claims
- 1357US11282814B2Semiconductor device assemblies including stacked individual modulesMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 22, 2022·0 cites·23 claims
- 1446US8084296B2Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methodsTHURGOOD BLAINE J·Filed 2009·Granted Dec 27, 2011·0 cites·13 claims
- 1540US2007148820A1Microelectronic devices and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2005·Application pending·0 cites
- 1639US2004200063A1Interposer substrates with multi-segment interconnect slots, semiconductor die packages including same, semiconductor dice for use therewith and methods of fabricationFiled 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →