Inventor
HEY H PETER W
US18 patents
⚠️ This page may combine multiple inventors who share the name “HEY H PETER W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
16 patentsUS5899752AMay 4, 1999
Method for in-situ cleaning of native oxide from silicon surfaces
APPLIED MATERIALS INC288 citations99
US5551982ASep 3, 1996
Semiconductor wafer process chamber with susceptor back coating
APPLIED MATERIALS INC136 citations99
US5599397AFeb 4, 1997
Semiconductor wafer process chamber with suspector back coating
APPLIED MATERIALS INC43 citations96
US5421957AJun 6, 1995
Low temperature etching in cold-wall CVD systems
APPLIED MATERIALS INC109 citations95
US7427338B2Sep 23, 2008
Flow diffuser to be used in electro-chemical plating system
APPLIED MATERIALS INC21 citations92
US6881318B2Apr 19, 2005
Dynamic pulse plating for high aspect ratio features
APPLIED MATERIALS INC38 citations92
US6837978B1Jan 4, 2005
Deposition uniformity control for electroplating apparatus, and associated method
APPLIED MATERIALS INC36 citations92
US6585876B2Jul 1, 2003
Flow diffuser to be used in electro-chemical plating system and method
APPLIED MATERIALS INC35 citations92
US6551484B2Apr 22, 2003
Reverse voltage bias for electro-chemical plating system and method
APPLIED MATERIALS INC29 citations92
US6551488B1Apr 22, 2003
Segmenting of processing system into wet and dry areas
APPLIED MATERIALS INC37 citations92
US6514671B1Feb 4, 2003
Interconnect line formed by dual damascene using dielectric layers having dissimilar etching characteristics
APPLIED MATERIALS INC39 citations92
US5834059ANov 10, 1998
Process of depositing a layer of material on a wafer with susceptor back coating
APPLIED MATERIALS INC29 citations92
US5482739AJan 9, 1996
Silicon nitride deposition
APPLIED MATERIALS INC47 citations92
US6130105AOct 10, 2000
Deposition rate control on wafers with varying characteristics
APPLIED MATERIALS INC21 citations91
US6022587AFeb 8, 2000
Method and apparatus for improving film deposition uniformity on a substrate
APPLIED MATERIALS INC20 citations88
US5725673AMar 10, 1998
Semiconductor wafer process chamber with susceptor back coating
APPLIED MATERIALS INC14 citations82