Inventor
TATSUMI TORU
JP42 patents
⚠️ This page may combine multiple inventors who share the name “TATSUMI TORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
27 patentsUS5366917ANov 22, 1994
Method for fabricating polycrystalline silicon having micro roughness on the surface
NEC CORP128 citations99
US6030894AFeb 29, 2000
Method for manufacturing a semiconductor device having contact plug made of Si/SiGe/Si
NEC CORP131 citations98
US5385863AJan 31, 1995
Method of manufacturing polysilicon film including recrystallization of an amorphous film
NEC CORP128 citations98
US6091081AJul 18, 2000
Insulating film comprising amorphous carbon fluoride, a semiconductor device comprising such an insulating film
NEC CORP55 citations96
US6075253AJun 13, 2000
Monocrystalline semiconductor photodetector
NEC CORP82 citations96
US5623243AApr 22, 1997
Semiconductor device having polycrystalline silicon layer with uneven surface defined by hemispherical or mushroom like shape silicon grain
NEC CORP85 citations96
US5866920AFeb 2, 1999
Semiconductor device and manufacturing method of the same
NEC CORP78 citations95
US5571735ANov 5, 1996
Method of manufacturing a semiconducter device capable of easily forming metal silicide films on source and drain regions
NEC CORP62 citations95
US6077355AJun 20, 2000
Apparatus and method for depositing a film on a substrate by chemical vapor deposition
NEC CORP24 citations93
US6071797AJun 6, 2000
Method for forming amorphous carbon thin film by plasma chemical vapor deposition
NEC CORP22 citations93
US5723379AMar 3, 1998
Method for fabricating polycrystalline silicon having micro roughness on the surface
NEC CORP19 citations93
US7701018B2Apr 20, 2010
Semiconductor device and method for manufacturing same
NEC CORP45 citations92
US7612416B2Nov 3, 2009
Semiconductor device having a conductive portion below an interlayer insulating film and method for producing the same
NEC CORP36 citations92
US5909059AJun 1, 1999
Semiconductor device having contact plug and method for manufacturing the same
NEC CORP37 citations92
US5895948AApr 20, 1999
Semiconductor device and fabrication process thereof
NEC CORP32 citations92
US6459126B1Oct 1, 2002
Semiconductor device including a MIS transistor
NEC CORP33 citations91
US7592674B2Sep 22, 2009
Semiconductor device with silicide-containing gate electrode and method of fabricating the same
NEC CORP14 citations83
US5691249ANov 25, 1997
Method for fabricating polycrystalline silicon having micro roughness on the surface
NEC CORP11 citations74
US6372628B1Apr 16, 2002
Insulating film comprising amorphous carbon fluoride, a semiconductor device comprising such an insulating film, and a method for manufacturing the semiconductor device
NEC CORP11 citations73
US6180531B1Jan 30, 2001
Semiconductor manufacturing method
NEC CORP10 citations73
US6790741B1Sep 14, 2004
Process for producing a semiconductor device
NEC CORP5 citations63
US6573211B2Jun 3, 2003
Metal oxide dielectric film
NEC CORP5 citations63
US6121120ASep 19, 2000
Method for manufacturing semiconductor device capable of flattening surface of selectively-grown silicon layer
NEC CORP6 citations63
US6060391AMay 9, 2000
Vapor phase growth method
NEC CORP6 citations63
US7679148B2Mar 16, 2010
Semiconductor device, production method and production device thereof
NEC CORP4 citations62
US7476916B2Jan 13, 2009
Semiconductor device having a mis-type fet, and methods for manufacturing the same and forming a metal oxide film
NEC CORP6 citations62
US5946570AAug 31, 1999
Process for fabricating semiconductor device having semiconductor layers epitaxially grown from active areas without short-circuit on field insulating layer
NEC CORP4 citations62
ANELVA CORP
3 patentsCANON ANELVA CORP
3 patentsUS7867847B2Jan 11, 2011
Method of manufacturing dielectric film that has hafnium-containing and aluminum-containing oxynitride
CANON ANELVA CORP7 citations84
US8030694B2Oct 4, 2011
Dielectric film and semiconductor device using dielectric film including hafnium, aluminum or silicon, nitrogen, and oxygen
CANON ANELVA CORP5 citations74
US8053311B2Nov 8, 2011
Dielectric film and semiconductor device using dielectric film including hafnium, aluminum or silicon, nitrogen, and oxygen
CANON ANELVA CORP3 citations63
NAKAGAWA TAKASHI
3 patentsUS8415753B2Apr 9, 2013
Semiconductor device and method of manufacturing the same
NAKAGAWA TAKASHI4 citations61
US8203176B2Jun 19, 2012
Dielectric, capacitor using dielectric, semiconductor device using dielectric, and manufacturing method of dielectric
NAKAGAWA TAKASHI2 citations60
US8524617B2Sep 3, 2013
Methods for manufacturing dielectric films
NAKAGAWA TAKASHI0 citations52