Inventor
TSENG CHUNG-YANG
TW2 patents
Patents
2 patentsUS6967145B2Nov 22, 2005
Method of maintaining photolithographic precision alignment after wafer bonding process
ASIA PACIFIC MICROSYSTEMS INC12 citations73
US6864176B2Mar 8, 2005
Fabrication process for bonded wafer precision layer thickness control and its non-destructive measurement method
ASIA PACIFIC MICROSYSTEMS INC0 citations45