Inventor
NARIZUKA YASUNORI
JP25 patents
⚠️ This page may combine multiple inventors who share the name “NARIZUKA YASUNORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS TECH CORP
12 patentsUS7049837B2May 23, 2006
Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method
RENESAS TECH CORP65 citations97
US7219422B2May 22, 2007
Fabrication method of semiconductor integrated circuit device
RENESAS TECH CORP21 citations91
US7776626B2Aug 17, 2010
Manufacturing method of semiconductor integrated circuit device
RENESAS TECH CORP15 citations84
US7724006B2May 25, 2010
Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device
RENESAS TECH CORP12 citations84
US7423439B2Sep 9, 2008
Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device
RENESAS TECH CORP12 citations83
US7235413B2Jun 26, 2007
Fabrication method of semiconductor integrated circuit device
RENESAS TECH CORP13 citations83
US7351597B2Apr 1, 2008
Fabrication method of semiconductor integrated circuit device
RENESAS TECH CORP10 citations82
US7656174B2Feb 2, 2010
Probe cassette, semiconductor inspection apparatus and manufacturing method of semiconductor device
RENESAS TECH CORP7 citations74
US7598100B2Oct 6, 2009
Manufacturing method of semiconductor integrated circuit device
RENESAS TECH CORP4 citations62
US7407823B2Aug 5, 2008
Manufacturing method of semiconductor integrated circuit device
RENESAS TECH CORP2 citations62
US7534629B2May 19, 2009
Manufacturing method of semiconductor integrated circuit device
RENESAS TECH CORP4 citations60
US7537943B2May 26, 2009
Method of manufacturing a semiconductor integrated circuit device
RENESAS TECH CORP0 citations41
HITACHI LTD
9 patentsUS6353540B1Mar 5, 2002
Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board.
HITACHI LTD181 citations98
US6707682B2Mar 16, 2004
Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board
HITACHI LTD40 citations92
US5320729AJun 14, 1994
Sputtering target
HITACHI LTD45 citations91
US5285016AFeb 8, 1994
Wiring board provided with a heat bypass layer
HITACHI LTD22 citations89
US6124553ASep 26, 2000
Multilayer wiring board having vent holes and method of making
HITACHI LTD17 citations84
US5958600ASep 28, 1999
Circuit board and method of manufacturing the same
HITACHI LTD11 citations73
US4806725AFeb 21, 1989
Circuit substrate and thermal printing head using the same
HITACHI LTD11 citations73
US5235313AAug 10, 1993
Thin film resistor and wiring board using the same
HITACHI LTD6 citations68
US5218335AJun 8, 1993
Electronic circuit device having thin film resistor and method for producing the same
HITACHI LTD6 citations62
RENESAS ELECTRONICS CORP
2 patentsHASEBE AKIO
2 patentsUS8062911B2Nov 22, 2011
Method of manufacturing a semiconductor integrated circuit device and a method of manufacturing a thin film probe sheet for using the same
HASEBE AKIO2 citations59
US8206997B2Jun 26, 2012
Method of manufacturing a semiconductor integrated circuit device and a method of manufacturing a thin film probe sheet for using the same
HASEBE AKIO1 citations49