Inventor
ISHINO MASAKAZU
JP20 patents
⚠️ This page may combine multiple inventors who share the name “ISHINO MASAKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
8 patentsUS5939789AAug 17, 1999
Multilayer substrates methods for manufacturing multilayer substrates and electronic devices
HITACHI LTD128 citations97
US5886409AMar 23, 1999
Electrode structure of wiring substrate of semiconductor device having expanded pitch
HITACHI LTD89 citations96
US5498768AMar 12, 1996
Process for forming multilayer wiring
HITACHI LTD60 citations96
US6137185AOct 24, 2000
Electrode structure of a wiring substrate of semiconductor device having expanded pitch
HITACHI LTD30 citations92
US5670421ASep 23, 1997
Process for forming multilayer wiring
HITACHI LTD31 citations92
US5320729AJun 14, 1994
Sputtering target
HITACHI LTD45 citations91
US5285016AFeb 8, 1994
Wiring board provided with a heat bypass layer
HITACHI LTD22 citations89
US5235313AAug 10, 1993
Thin film resistor and wiring board using the same
HITACHI LTD6 citations68
ELPIDA MEMORY INC
7 patentsUS7576433B2Aug 18, 2009
Semiconductor memory device and manufacturing method thereof
ELPIDA MEMORY INC38 citations96
US7638362B2Dec 29, 2009
Memory module with improved mechanical strength of chips
ELPIDA MEMORY INC22 citations92
US7893540B2Feb 22, 2011
Semiconductor memory device and manufacturing method thereof
ELPIDA MEMORY INC11 citations84
US7564127B2Jul 21, 2009
Memory module that is capable of controlling input/output in accordance with type of memory chip
ELPIDA MEMORY INC9 citations84
US7791196B2Sep 7, 2010
Semiconductor device having a smaller electrostatic capacitance electrode
ELPIDA MEMORY INC4 citations63
US7754581B2Jul 13, 2010
Method for manufacturing a three-dimensional semiconductor device and a wafer used therein
ELPIDA MEMORY INC5 citations63
US7618847B2Nov 17, 2009
Bonding method of semiconductor and laminated structure fabricated thereby
ELPIDA MEMORY INC1 citations52
ISHINO MASAKAZU
3 patentsUS8513121B2Aug 20, 2013
Semiconductor memory device and manufacturing method thereof
ISHINO MASAKAZU7 citations82
US8298940B2Oct 30, 2012
Semiconductor memory device and manufacturing method thereof
ISHINO MASAKAZU11 citations82
US8334465B2Dec 18, 2012
Wafer of circuit board and joining structure of wafer or circuit board
ISHINO MASAKAZU0 citations39