Inventor

GELORME JEFFREY D

US75 patents

⚠️ This page may combine multiple inventors who share the name “GELORME JEFFREY D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GELORME JEFFREY D

IBM

Chip handling and electronic component integration

Method and apparatus for chip-cooling

Water-soluble electrically conducting polymers, their synthesis and use

Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive

Methods of fabrication of cross-linked electrically conductive polymers and precursors thereof

Tuneable apparatus for microwave processing

Composition for photo imaging

Photoresist composition and printed circuit boards and packages made therewith

Cleavable diepoxide for removable epoxy compositions

Cleavable diepoxide for removable epoxy compositions

Method for patterning cationic curable photoresist

Polymeric optical waveguides and methods of forming the same

Heterogeneous thermal interface for cooling

Methods of fabrication of cross-linked electrically conductive polymers and precursors thereof

Solid state chain extension polymerization between Lewis acid oligomers and deblocked Lewis bases

Microwave processing

Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition

Photosensitive composition with cyanate esters and use thereof

Microwave processing

Ultraviolet light sensitive photoinitiator compositions, use thereof and radiation sensitive compositions

Roughening surface of a substrate

Electrically conductive and abrasion/scratch resistant polymeric materials, method of fabrication thereof and uses thereof

Aqueous soldermask

Composition for photo imaging

Base developable negative photoresist composition and use thereof

Composition for photo imaging

Photocurable epoxy composition with sulfonium salt photoinitiator

Sulfonium salts and use and preparation thereof

Low temperature adhesive resins for wafer bonding

Apparatus and methods for cooling semiconductor integrated circuit package structures

Apparatus and methods for cooling semiconductor integrated circuit package structures

Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation

Dry developable photoresist containing an epoxide, organosilicon and onium salt

Liquid recovery, collection method and apparatus in a non-recirculating test and burn-in application

Cross-linked electrically conductive polymers, precursors thereof

Epoxy functional organosilicon polymer

Method for forming a pattern

Method for forming a pattern of a photoresist

Chip handling and electronic component integration

IR assisted fan-out wafer level packaging using silicon handler

Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding

Chip handling and electronic component integration

Low temperature adhesive resins for wafer bonding

Toughened photosensitive polycyanurate resist, and structure made therefrom and process of making

Polyamic acid and polyimide from fluorinated reactant

Photosensitive composition and use thereof

Microwave processing

Encapsulated wire circuit board

HOUGHAM GARETH

Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive

Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive