Inventor
CADIEN KENNETH C
US28 patents
⚠️ This page may combine multiple inventors who share the name “CADIEN KENNETH C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
24 patentsUS5783478AJul 21, 1998
Method of frabricating a MOS transistor having a composite gate electrode
INTEL CORP157 citations99
US5625217AApr 29, 1997
MOS transistor having a composite gate electrode and method of fabrication
INTEL CORP162 citations99
US6046099AApr 4, 2000
Plug or via formation using novel slurries for chemical mechanical polishing
INTEL CORP89 citations98
US5954975ASep 21, 1999
Slurries for chemical mechanical polishing tungsten films
INTEL CORP90 citations98
US5700383ADec 23, 1997
Slurries and methods for chemical mechanical polish of aluminum and titanium aluminide
INTEL CORP176 citations98
US5611943AMar 18, 1997
Method and apparatus for conditioning of chemical-mechanical polishing pads
INTEL CORP120 citations98
US5516346AMay 14, 1996
Slurries for chemical mechanical polishing
INTEL CORP106 citations98
US5340370AAug 23, 1994
Slurries for chemical mechanical polishing
INTEL CORP410 citations98
US6178585B1Jan 30, 2001
Slurries for chemical mechanical polishing
INTEL CORP25 citations95
US5836806ANov 17, 1998
Slurries for chemical mechanical polishing
INTEL CORP60 citations95
US5407526AApr 18, 1995
Chemical mechanical polishing slurry delivery and mixing system
INTEL CORP171 citations95
US6719614B2Apr 13, 2004
Method and chemistry for cleaning of oxidized copper during chemical mechanical polishing
INTEL CORP13 citations92
US6464568B2Oct 15, 2002
Method and chemistry for cleaning of oxidized copper during chemical mechanical polishing
INTEL CORP27 citations92
US6443814B1Sep 3, 2002
Method and chemistry for cleaning of oxidized copper during chemical mechanical polishing
INTEL CORP35 citations92
US6375552B1Apr 23, 2002
Slurries for chemical mechanical polishing
INTEL CORP18 citations92
US6087733AJul 11, 2000
Sacrificial erosion control features for chemical-mechanical polishing process
INTEL CORP77 citations92
US6358853B2Mar 19, 2002
Ceria based slurry for chemical-mechanical polishing
INTEL CORP19 citations88
US5604158AFeb 18, 1997
Integrated tungsten/tungsten silicide plug process
INTEL CORP37 citations87
US6740591B1May 25, 2004
Slurry and method for chemical mechanical polishing of copper
INTEL CORP17 citations83
US6752844B2Jun 22, 2004
Ceric-ion slurry for use in chemical-mechanical polishing
INTEL CORP11 citations73
US7087188B2Aug 8, 2006
Abrasives for chemical mechanical polishing
INTEL CORP2 citations62
US6881674B2Apr 19, 2005
Abrasives for chemical mechanical polishing
INTEL CORP3 citations62
US7666465B2Feb 23, 2010
Introducing nanotubes in trenches and structures formed thereby
INTEL CORP1 citations52
US7182882B2Feb 27, 2007
Method of improving chemical mechanical polish endpoint signals by use of chemical additives
INTEL CORP0 citations49
ZINITE CORP
4 patentsUS12593467B2Mar 31, 2026
Thin film semiconductor switching device
ZINITE CORP0 citations54
US12446258B2Oct 14, 2025
Thin film semiconductor switching device
ZINITE CORP0 citations54
US11949019B2Apr 2, 2024
Thin film semiconductor switching device
ZINITE CORP0 citations54
US12302605B2May 13, 2025
Hafnium nitride adhesion layer
ZINITE CORP0 citations42