Inventor
LIU JEN-HAO
TW34 patents
⚠️ This page may combine multiple inventors who share the name “LIU JEN-HAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
19 patentsUS11192775B2Dec 7, 2021
Rough layer for better anti-stiction deposition
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11174156B2Nov 16, 2021
Bonding process for forming semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10173886B2Jan 8, 2019
Rough anti-stiction layer for MEMS device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US9884755B2Feb 6, 2018
Rough anti-stiction layer for MEMS device
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US9725312B1Aug 8, 2017
Preconditioning to enhance hydrophilic fusion bonding
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations68
US12258265B2Mar 25, 2025
Bonding process for forming semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11772963B2Oct 3, 2023
Bonding process for forming semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11192778B2Dec 7, 2021
MEMS package with roughend interface
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10273141B2Apr 30, 2019
Rough layer for better anti-stiction deposition
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US11034578B2Jun 15, 2021
Multi-layer sealing film for high seal yield
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations57
US11211354B2Dec 28, 2021
Systems and methods for semi-flexible eutectic bonder piece arranegments
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10626010B2Apr 21, 2020
Bonding process for forming semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10112826B2Oct 30, 2018
Method for forming micro-electro-mechanical system (MEMS) device structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10759654B2Sep 1, 2020
Rough anti-stiction layer for MEMS device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10710872B2Jul 14, 2020
MEMS package with roughend interface
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9481567B2Nov 1, 2016
MEMS structure, cap substrate and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations50
US9230918B1Jan 5, 2016
Semiconductor package structure, alignment structure, and alignment method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10676343B2Jun 9, 2020
Multi-layer sealing film for high seal yield
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations46
US10322928B2Jun 18, 2019
Multi-layer sealing film for high seal yield
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations46
COMPAL ELECTRONICS INC
4 patentsUS7234204B2Jun 26, 2007
Pivotal hinge mechanism for mobile computer
COMPAL ELECTRONICS INC30 citations91
US7216900B2May 15, 2007
Fastener module for portable computers
COMPAL ELECTRONICS INC23 citations89
US6175496B1Jan 16, 2001
Heat-dissipating device
COMPAL ELECTRONICS INC3 citations60
US7170740B1Jan 30, 2007
Foldable support structure
COMPAL ELECTRONICS INC4 citations57
WISTRON CORP
3 patentsUS9455759B2Sep 27, 2016
Protection device capable of rotatably supporting a portable electronic device
WISTRON CORP15 citations81
US9483088B2Nov 1, 2016
Method for assembling a touch control display apparatus and the touch control display apparatus
WISTRON CORP0 citations46
US9559738B1Jan 31, 2017
Tablet device with pivot unit having twist spring
WISTRON CORP0 citations41