Inventor
MIN FAN-YU
TW4 patents
Patents
4 patentsUS11107791B2Aug 31, 2021
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations67
US11094649B2Aug 17, 2021
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations55
US11244909B2Feb 8, 2022
Package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations53
US10943800B2Mar 9, 2021
Semiconductor package device and method of forming package body
ADVANCED SEMICONDUCTOR ENG0 citations47