Inventor

GOCHNOUR DEREK

US40 patents

⚠️ This page may combine multiple inventors who share the name “GOCHNOUR DEREK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GOCHNOUR DEREK

MICRON TECHNOLOGY INC

System for testing semiconductor components having flexible interconnect

Flexible semiconductor interconnect fabricated by backslide thinning

Carrier and system for testing bumped semiconductor components

Semiconductor package with wire bond protective member

Interconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with contact bumps

Semiconductor package with pre-fabricated cover and method of fabrication

Flexible semiconductor interconnect fabricated by backside thinning

Method for testing semiconductor components

System for testing semiconductor components

Semiconductor package with pre-fabricated cover

Method for forming an interconnect for testing unpackaged semiconductor dice

Carrier and system for testing bumped semiconductor components

Interconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with contact bumps

Hybrid interconnect and system for testing semiconductor dice

Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching

Method of forming a semiconductor chip carrier

Method for testing semiconductor components

Test carrier with molded interconnect for testing semiconductor components

Clip chip carrier

Test carrier with variable force applying mechanism for testing semiconductor components

Method for forming an interconnect for testing unpackaged semiconductor dice

Method for fabricating microbump interconnect for bare semiconductor dice

Test carrier with variable force applying mechanism for testing semiconductor components

Method of making a spring element for use in an apparatus for attaching to a semiconductor

Apparatus for attaching to a semiconductor

Spring element for use in an apparatus for attaching to a semiconductor and a method of making

Spring element for use in an apparatus for attaching to a semiconductor and a method of making

Test carrier with molded interconnect for testing semiconductor components

Spring element for use in an apparatus for attaching to a semiconductor and a method of making

Semiconductor package with wire bond protective member

Clip chip carrier

Test carrier with molded interconnect for testing semiconductor components

Hybrid interconnect and system for testing semiconductor dice

Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching

SEMICONDUCTOR COMPONENTS IND LLC

Chip scale package and related methods

Image sensor packages and related methods

Chip scale package and related methods

Chip scale package and related methods

MICRON DISPLAY TECH INC

Method of mechanical and electrical substrate connection

Methods of mechanical and electrical substrate connection