Inventor
HOWELL WAYNE J
US34 patents
Patents
34 patentsUS6358627B2Mar 19, 2002
Rolling ball connector
IBM164 citations99
US6265771B1Jul 24, 2001
Dual chip with heat sink
IBM209 citations99
US5926029AJul 20, 1999
Ultra fine probe contacts
IBM151 citations99
US5571754ANov 5, 1996
Method of fabrication of endcap chip with conductive, monolithic L-connect for multichip stack
IBM191 citations99
US5567654AOct 22, 1996
Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging
IBM150 citations99
US5563086AOct 8, 1996
Integrated memory cube, structure and fabrication
IBM195 citations99
US5561622AOct 1, 1996
Integrated memory cube structure
IBM250 citations99
US5478781ADec 26, 1995
Polyimide-insulated cube package of stacked semiconductor device chips
IBM174 citations99
US5466634ANov 14, 1995
Electronic modules with interconnected surface metallization layers and fabrication methods therefore
IBM153 citations99
US6611050B1Aug 26, 2003
Chip edge interconnect apparatus and method
IBM79 citations98
US6559666B2May 6, 2003
Method and device for semiconductor testing using electrically conductive adhesives
IBM80 citations98
US6271102B1Aug 7, 2001
Method and system for dicing wafers, and semiconductor structures incorporating the products thereof
IBM125 citations98
US6233184B1May 15, 2001
Structures for wafer level test and burn-in
IBM102 citations98
US6177729B1Jan 23, 2001
Rolling ball connector
IBM84 citations98
US5502667AMar 26, 1996
Integrated multichip memory module structure
IBM291 citations97
US6258627B1Jul 10, 2001
Underfill preform interposer for joining chip to substrate
IBM69 citations96
US5903045AMay 11, 1999
Self-aligned connector for stacked chip module
IBM51 citations96
US5517754AMay 21, 1996
Fabrication processes for monolithic electronic modules
IBM98 citations96
US5517057AMay 14, 1996
Electronic modules with interconnected surface metallization layers
IBM87 citations96
US7132841B1Nov 7, 2006
Carrier for test, burn-in, and first level packaging
IBM37 citations93
US6426241B1Jul 30, 2002
Method for forming three-dimensional circuitization and circuits formed
IBM39 citations93
US6915795B2Jul 12, 2005
Method and system for dicing wafers, and semiconductor structures incorporating the products thereof
IBM20 citations92
US6806578B2Oct 19, 2004
Copper pad structure
IBM32 citations92
US6426904B2Jul 30, 2002
Structures for wafer level test and burn-in
IBM43 citations92
US6288559B1Sep 11, 2001
Semiconductor testing using electrically conductive adhesives
IBM20 citations92
US5596226AJan 21, 1997
Semiconductor chip having a chip metal layer and a transfer metal and corresponding electronic module
IBM32 citations92
US6104082AAug 15, 2000
Metallization structure for altering connections
IBM44 citations87
US7394268B2Jul 1, 2008
Carrier for test, burn-in, and first level packaging
IBM13 citations84
US6645789B2Nov 11, 2003
On chip alpha-particle detector
IBM12 citations74
US6545330B1Apr 8, 2003
On chip alpha-particle detector
IBM5 citations74
US6268739B1Jul 31, 2001
Method and device for semiconductor testing using electrically conductive adhesives
IBM12 citations74
US6030855AFeb 29, 2000
Self-aligned connector for stacked chip module
IBM14 citations74
US5614277AMar 25, 1997
Monolithic electronic modules--fabrication and structures
IBM9 citations74
US6600213B2Jul 29, 2003
Semiconductor structure and package including a chip having chamfered edges
IBM7 citations73