Inventor

PIERSON MARK V

US69 patents

⚠️ This page may combine multiple inventors who share the name “PIERSON MARK V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PIERSON MARK V

IBM

Surface metal balancing to reduce chip carrier flexing

Rolling ball connector

Method and device for semiconductor testing using electrically conductive adhesives

Rolling ball connector

Low or no-force bump flattening structure and method

Method for bonding heat sinks to overmolds and device formed thereby

Encapsulation of solder bumps and solder connections

Semiconductor chip carrier assembly

Stiffeners with improved adhesion to flexible substrates

Method for restraining circuit board warp during area array rework

Manufacturing flexible circuit board assemblies and printer for screening solder paste in such manufacture

Manufacturing flexible circuit board assemblies with common heat spreaders

Pressurized injection nozzle for screening paste

Circuit board having a defined volume of solder or conductive adhesive deposited at interconnection sites for electrical circuits

Method for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection head

Method and apparatus for testing integrated circuit chips

Method and apparatus for testing of integrated circuit chips

Panel structure with plurality of chip compartments for providing high volume of chip modules

Method and apparatus for testing integrated circuit chips

Dockable interface airlock between process enclosure and interprocess transfer container

Apparatus for maximizing light beam utilization

Flip chip C4 extension structure and process

Flip chip C4 extension structure and process

Common heatsink for multiple chips and modules

Semiconductor testing using electrically conductive adhesives

TFT panel alignment and attachment method and apparatus

Apparatus for manufacturing circuit boards

Method of making electrically conductive contacts on substrates

Chip C4 assembly improvement using magnetic force and adhesive

TFT panel alignment and attachment method and apparatus

Electronic package assembly

Flexible circuit board and common heat spreader assembly

Advanced chip packaging structure for memory card applications

Method of printed circuit panel manufacture

Method of making electrically conductive contacts on substrates

System and method for capturing contaminants within a disk drive

Panel structure with plurality of chip compartments for providing high volume of chip modules

Method for bonding heat sinks to overmolds and device formed thereby

LCD cover optical structure and method

Method for bonding heat sinks to overmolds and device formed thereby

Method and device for semiconductor testing using electrically conductive adhesives

Pin retention method and apparatus

Process for making semiconductor chip assembly

TFT panel alignment and attachment method and apparatus

Chip C4 assembly improvement using magnetic force and adhesive

System for replacing a first area array component connected to an interconnect board

PIERSON MARK V

Solar recharge station for electric vehicles

Longitudinally fed component insertion apparatus

D AMELIA ANTHONY

No touch utensil dispenser

USM CORP

Automatic component dispensor