Inventor
TRIVEDI AJIT K
US10 patents
Patents
10 patentsUS6559666B2May 6, 2003
Method and device for semiconductor testing using electrically conductive adhesives
IBM80 citations98
US6674647B2Jan 6, 2004
Low or no-force bump flattening structure and method
IBM92 citations97
US5620782AApr 15, 1997
Method of fabricating a flex laminate package
IBM59 citations95
US5384690AJan 24, 1995
Flex laminate package for a parallel processor
IBM61 citations95
US5418689AMay 23, 1995
Printed circuit board or card for direct chip attachment and fabrication thereof
IBM67 citations94
US6288559B1Sep 11, 2001
Semiconductor testing using electrically conductive adhesives
IBM20 citations92
US5509196AApr 23, 1996
Method of fabricating a flex laminate package
IBM24 citations91
US5435480AJul 25, 1995
Method for filling plated through holes
IBM67 citations91
US6268739B1Jul 31, 2001
Method and device for semiconductor testing using electrically conductive adhesives
IBM12 citations74
US6492071B1Dec 10, 2002
Wafer scale encapsulation for integrated flip chip and surface mount technology assembly
IBM4 citations62