Inventor
KURISU HIROKAZU
JP5 patents
Patents
5 patentsUS6376332B1Apr 23, 2002
Composite member and separating method therefor, bonded substrate stack and separating method therefor, transfer method for transfer layer, and SOI substrate manufacturing method
CANON KK93 citations97
US6979629B2Dec 27, 2005
Method and apparatus for processing composite member
CANON KK18 citations92
US6900114B2May 31, 2005
Separating apparatus, separating method, and method of manufacturing semiconductor substrate
CANON KK20 citations92
US6653206B2Nov 25, 2003
Method and apparatus for processing composite member
CANON KK21 citations92
US6609446B1Aug 26, 2003
Separating apparatus, separating method, and method of manufacturing semiconductor substrate
CANON KK9 citations73