Inventor
KAMEI KOJI
JP41 patents
⚠️ This page may combine multiple inventors who share the name “KAMEI KOJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHOWA DENKO KK
18 patentsUS7741653B2Jun 22, 2010
Gallium nitride-based compound semiconductor light-emitting device
SHOWA DENKO KK21 citations92
US8049243B2Nov 1, 2011
Gallium nitride-based compound semiconductor light emitting device
SHOWA DENKO KK11 citations82
US11320388B2May 3, 2022
SiC epitaxial wafer containing large pit defects with a surface density of 0.5 defects/CM2 or less, and production method therefor
SHOWA DENKO KK4 citations72
US11293115B2Apr 5, 2022
Method for producing a SiC epitaxial wafer containing a total density of large pit defects and triangular defects of 0.01 defects/cm2 or more and 0.6 defects/cm2 or less
SHOWA DENKO KK5 citations72
US7952116B2May 31, 2011
Gallium nitride-based compound semiconductor light-emitting device
SHOWA DENKO KK5 citations63
US7759690B2Jul 20, 2010
Gallium nitride-based compound semiconductor light-emitting device
SHOWA DENKO KK5 citations63
US7544974B2Jun 9, 2009
Positive electrode for compound semiconductor light-emitting device
SHOWA DENKO KK5 citations63
US7452740B2Nov 18, 2008
Gallium nitride-based compound semiconductor light-emitting device and negative electrode thereof
SHOWA DENKO KK4 citations63
US11961736B2Apr 16, 2024
SiC epitaxial wafer, production method therefor, and defect identification method
SHOWA DENKO KK0 citations62
US11705329B2Jul 18, 2023
SiC epitaxial wafer and method for manufacturing same
SHOWA DENKO KK0 citations62
US11315839B2Apr 26, 2022
Evaluation method and manufacturing method of SiC epitaxial wafer
SHOWA DENKO KK1 citations62
US11249027B2Feb 15, 2022
SiC substrate evaluation method and method for manufacturing SiC epitaxtal wafer
SHOWA DENKO KK0 citations62
US10985042B2Apr 20, 2021
SiC substrate, SiC epitaxial wafer, and method of manufacturing the same
SHOWA DENKO KK0 citations62
US10955350B2Mar 23, 2021
SiC wafer defect measuring method, reference sample, and method of manufacturing SiC epitaxial wafer
SHOWA DENKO KK1 citations62
US10865500B2Dec 15, 2020
SiC epitaxial wafer and method for manufacturing SiC epitaxial wafer
SHOWA DENKO KK1 citations60
US7518163B2Apr 14, 2009
Gallium nitride-based compound semiconductor light-emitting device and negative electrode thereof
SHOWA DENKO KK0 citations52
US10697898B2Jun 30, 2020
SiC substrate evaluation method and method for manufacturing SiC epitaxial wafer
SHOWA DENKO KK0 citations51
US7875896B2Jan 25, 2011
Transparent positive electrode
SHOWA DENKO KK1 citations50
NEC TOKIN CORP
8 patentsUS6595802B1Jul 22, 2003
Connector capable of considerably suppressing a high-frequency current
NEC TOKIN CORP105 citations98
US6635819B2Oct 21, 2003
Electronic component comprising a metallic case provided with a magnetic loss material
NEC TOKIN CORP16 citations82
US6903440B2Jun 7, 2005
Electronic component of a high frequency current suppression type and bonding wire for the same
NEC TOKIN CORP7 citations74
US6635961B2Oct 21, 2003
Electronic component of a high frequency current suppression type and bonding wire for the same
NEC TOKIN CORP6 citations74
US6921573B2Jul 26, 2005
High-frequency current suppression body using magnetic loss material exhibiting outstanding complex permeability characteristics
NEC TOKIN CORP10 citations73
US6723914B1Apr 20, 2004
Composite magnetic tape
NEC TOKIN CORP10 citations73
US6703778B2Mar 9, 2004
Light emitting element, plasma display panel, and CRT display device capable of considerably suppressing a high-frequency noise
NEC TOKIN CORP6 citations63
US6810584B2Nov 2, 2004
Heat-shrinkable tube, heat-shrinkable sheet, and method of shrinking the same
NEC TOKIN CORP3 citations62
TOKIN CORP
5 patentsUS6362434B1Mar 26, 2002
Magnetic prepreg, its manufacturing method and printed wiring board employing the prepreg
TOKIN CORP21 citations92
US5898346AApr 27, 1999
Dual-band nonreversible circuit device comprising two nonreversible circuit elements contained in a single housing to be operable in different frequency bands
TOKIN CORP18 citations83
US6051156AApr 18, 2000
Compound magnetic material and electromagnetic interference suppressor
TOKIN CORP7 citations74
US6011887AJan 4, 2000
Optical fiber cable
TOKIN CORP13 citations74
US6310285B1Oct 30, 2001
EMI preventive part and active device with the same
TOKIN CORP6 citations63
KAMEI KOJI
3 patentsUS8093605B2Jan 10, 2012
Gallium nitride-based compound semiconductor light-emitting device with an electrode covered by an over-coating layer
KAMEI KOJI9 citations82
US8748903B2Jun 10, 2014
Semiconductor light emitting element and method for manufacturing semiconductor light emitting element
KAMEI KOJI2 citations60
US8829555B2Sep 9, 2014
Semiconductor light emission element
KAMEI KOJI2 citations58