Inventor
SATHE SANJEEV B
US20 patents
⚠️ This page may combine multiple inventors who share the name “SATHE SANJEEV B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
19 patentsUS6665187B1Dec 16, 2003
Thermally enhanced lid for multichip modules
IBM108 citations97
US5926369AJul 20, 1999
Vertically integrated multi-chip circuit package with heat-sink support
IBM182 citations97
US6061245AMay 9, 2000
Free standing, three dimensional, multi-chip, carrier package with air flow baffle
IBM91 citations96
US6075287AJun 13, 2000
Integrated, multi-chip, thermally conductive packaging device and methodology
IBM70 citations95
US7186590B2Mar 6, 2007
Thermally enhanced lid for multichip modules
IBM26 citations92
US6992379B2Jan 31, 2006
Electronic package having a thermal stretching layer
IBM40 citations92
US6759270B2Jul 6, 2004
Semiconductor chip module and method of manufacture of same
IBM23 citations92
US6756662B2Jun 29, 2004
Semiconductor chip module and method of manufacture of same
IBM19 citations92
US6731012B1May 4, 2004
Non-planar surface for semiconductor chips
IBM15 citations92
US6622786B1Sep 23, 2003
Heat sink structure with pyramidic and base-plate cut-outs
IBM45 citations92
US6256203B1Jul 3, 2001
Free standing, three dimensional, multi-chip, carrier package with air flow baffle
IBM22 citations91
US5914857AJun 22, 1999
Air flow devices for electronic boards
IBM12 citations74
US6967389B2Nov 22, 2005
Wafer with semiconductor chips mounted thereon
IBM4 citations73
US6291776B1Sep 18, 2001
Thermal deformation management for chip carriers
IBM13 citations73
US6219234B1Apr 17, 2001
Method for using pulsating flow to improve thermal transport in systems
IBM11 citations73
US7037753B2May 2, 2006
Non-planar surface for semiconductor chips
IBM2 citations62
US7183642B2Feb 27, 2007
Electronic package with thermally-enhanced lid
IBM0 citations51
US6989607B2Jan 24, 2006
Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers
IBM0 citations51
US6639302B2Oct 28, 2003
Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carries
IBM0 citations51