Inventor
THIEL GEORGE H
US11 patents
Patents
11 patentsUS6552266B2Apr 22, 2003
High performance chip packaging and method
IBM96 citations95
US6235994B1May 22, 2001
Thermal/electrical break for printed circuit boards
IBM67 citations95
US7045562B2May 16, 2006
Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls
IBM26 citations92
US6759270B2Jul 6, 2004
Semiconductor chip module and method of manufacture of same
IBM23 citations92
US6756662B2Jun 29, 2004
Semiconductor chip module and method of manufacture of same
IBM19 citations92
US6731012B1May 4, 2004
Non-planar surface for semiconductor chips
IBM15 citations92
US6967389B2Nov 22, 2005
Wafer with semiconductor chips mounted thereon
IBM4 citations73
US6649833B1Nov 18, 2003
Negative volume expansion lead-free electrical connection
IBM12 citations73
US6552264B2Apr 22, 2003
High performance chip packaging and method
IBM9 citations71
US7037753B2May 2, 2006
Non-planar surface for semiconductor chips
IBM2 citations62
US6655020B2Dec 2, 2003
Method of packaging a high performance chip
IBM0 citations49