Inventor
LIN YU-BIN
CN2 patents
Patents
2 patentsUS9640413B2May 2, 2017
Etching-before-packaging horizontal chip 3D system-level metal circuit board structure and technique thereof
JIANGSU CHANGJIANG ELECTRONICS TECH CO LTD1 citations40
US9633985B2Apr 25, 2017
First-etched and later-packaged three-dimensional system-in-package normal chip stack package structure and processing method thereof
JIANGSU CHANGJIANG ELECTRONICS TECH CO LTD0 citations31