Inventor
ICHIKAWA TSUKASA
JP2 patents
Patents
2 patentsUS12237293B2Feb 25, 2025
Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereof
TANAKA ELECTRONICS IND0 citations48
US11876066B2Jan 16, 2024
Palladium-coated copper bonding wire, wire bonding structure, semiconductor device, and manufacturing method of semiconductor device
TANAKA ELECTRONICS IND0 citations47