Inventor
ISHIDA NAOTO
JP18 patents
⚠️ This page may combine multiple inventors who share the name “ISHIDA NAOTO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBIDEN CO LTD
14 patentsUS6591495B2Jul 15, 2003
Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating
IBIDEN CO LTD102 citations98
US6809415B2Oct 26, 2004
Printed-circuit board and method of manufacture thereof
IBIDEN CO LTD80 citations97
US7415761B2Aug 26, 2008
Method of manufacturing multilayered circuit board
IBIDEN CO LTD35 citations95
US6232558B1May 15, 2001
Electronic component mounting base board having heat slug with slits and projections
IBIDEN CO LTD53 citations95
US7832098B2Nov 16, 2010
Method of manufacturing a multilayered printed circuit board
IBIDEN CO LTD10 citations83
US9433106B2Aug 30, 2016
Method for manufacturing printed wiring board
IBIDEN CO LTD5 citations73
US6455783B1Sep 24, 2002
Multilayer printed wiring board and method for manufacturing the same
IBIDEN CO LTD11 citations73
US9185799B2Nov 10, 2015
Printed wiring board
IBIDEN CO LTD6 citations72
US8742553B2Jun 3, 2014
Printed wiring board
IBIDEN CO LTD4 citations72
US6201185B1Mar 13, 2001
Substrate for mounting electronic part having conductive projections and process for manufacturing the same
IBIDEN CO LTD8 citations71
US9048229B2Jun 2, 2015
Printed wiring board
IBIDEN CO LTD2 citations62
US7222776B2May 29, 2007
Printed wiring board and manufacturing method therefor
IBIDEN CO LTD3 citations62
US6784374B2Aug 31, 2004
Printed wiring board and manufacturing method therefor
IBIDEN CO LTD3 citations62
US9374903B2Jun 21, 2016
Multilayer printed wiring board for mounting semiconductor element
IBIDEN CO LTD0 citations40