Inventor
MILLER LEAH M
US17 patents
⚠️ This page may combine multiple inventors who share the name “MILLER LEAH M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LSI LOGIC CORP
14 patentsUS6701270B1Mar 2, 2004
Method for reliability testing leakage characteristics in an electronic circuit and a testing device for accomplishing the source
LSI LOGIC CORP67 citations95
US6762366B1Jul 13, 2004
Ball assignment for ball grid array package
LSI LOGIC CORP39 citations92
US6744130B1Jun 1, 2004
Isolated stripline structure
LSI LOGIC CORP18 citations83
US6459049B1Oct 1, 2002
High density signal routing
LSI LOGIC CORP14 citations83
US7062742B2Jun 13, 2006
Routing structure for transceiver core
LSI LOGIC CORP9 citations73
US7051434B2May 30, 2006
Designing a ball assignment for a ball grid array package
LSI LOGIC CORP7 citations73
US6858930B2Feb 22, 2005
Multi chip module
LSI LOGIC CORP8 citations73
US6791177B1Sep 14, 2004
Integrated circuit packaging that uses guard conductors to isolate noise-sensitive signals within the package substrate
LSI LOGIC CORP8 citations73
US6680532B1Jan 20, 2004
Multi chip module
LSI LOGIC CORP6 citations73
US6963129B1Nov 8, 2005
Multi-chip package having a contiguous heat spreader assembly
LSI LOGIC CORP8 citations72
US6768386B1Jul 27, 2004
Dual clock package option
LSI LOGIC CORP3 citations62
US6445066B1Sep 3, 2002
Splitting and assigning power planes
LSI LOGIC CORP6 citations62
US6534968B1Mar 18, 2003
Integrated circuit test vehicle
LSI LOGIC CORP3 citations58
US7319272B2Jan 15, 2008
Ball assignment system
LSI LOGIC CORP0 citations41