Inventor · disambiguated record
Jong-Oh Kwon
Also filed as: KWON JONG O · KWON JONG-OH
34 granted patents·7 pending applications·347 citations·filing 2004–2023
97Inventor score
Files withSAMSUNG ELECTRONICS CO LTD21SAMSUNG ELECTRO MECH5KWON JONG-OH4KIM CHE-HEUNG3CHOI SEUNG-TAE2
Top patents by PatentIndex Score
41 records- 0197US7285865B2Micro-package, multi-stack micro-package, and manufacturing method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Oct 23, 2007·57 cites·23 claims
- 0294US8970513B2Touch panel having deformable electroactive polymer actuatorKWON JONG-OH·Filed 2011·Granted Mar 3, 2015·28 cites·15 claims
- 0394US8384271B2Electroactive polymer actuator and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Feb 26, 2013·18 cites·19 claims
- 0493US8564181B2Electroactive polymer actuator and method of manufacturing the sameCHOI SEUNG-TAE·Filed 2011·Granted Oct 22, 2013·23 cites·25 claims
- 0591US7719167B2Electroactive polymer actuator and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 18, 2010·22 cites·21 claims
- 0691US7408434B2Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 5, 2008·17 cites·8 claims
- 0790US8599490B2Liquid lensLEE JEONG-YUB·Filed 2010·Granted Dec 3, 2013·15 cites·27 claims
- 0890US7417525B2High efficiency inductor, method for manufacturing the inductor, and packaging structure using the inductorSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 26, 2008·18 cites·16 claims
- 0990US7374972B2Micro-package, multi-stack micro-package, and manufacturing method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 20, 2008·18 cites·15 claims
- 1087US8061910B2Micro shutter having iris function, method for manufacturing the same, and micro camera module having the sameKIM CHE-HEUNG·Filed 2008·Granted Nov 22, 2011·9 cites·27 claims
- 1187US7663083B2Image sensor module having electric component and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 16, 2010·16 cites·19 claims
- 1286US9870100B2Multi-touch sensing apparatus using rear view camera of array typeSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 16, 2018·4 cites·5 claims
- 1386US8552623B2Polymer and polymer actuator comprising the sameCHOI SEUNG-TAE·Filed 2010·Granted Oct 8, 2013·5 cites·10 claims
- 1486US8147150B2Micro shutter having iris function, method for manufacturing the same, and micro camera module having the sameKIM CHE-HEUNG·Filed 2011·Granted Apr 3, 2012·5 cites·18 claims
- 1586US7755151B2Wafer level package for surface acoustic wave device and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jul 13, 2010·15 cites·11 claims
- 1684US7619837B2Varifocal optical deviceSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Nov 17, 2009·12 cites·12 claims
- 1784US7449366B2Wafer level packaging cap and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 11, 2008·12 cites·18 claims
- 1880US9434801B2Polymer and polymer actuator comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 6, 2016·2 cites·7 claims
- 1978US9098146B2Multi-touch sensing apparatus using rear view camera of array typeYI KWON JU·Filed 2010·Granted Aug 4, 2015·4 cites·7 claims
- 2074US7456709B2Bulk acoustic resonator including a resonance part with dimple and fabrication method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 25, 2008·7 cites·5 claims
- 2173US7963021B2Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jun 21, 2011·4 cites·2 claims
- 2272US9182614B2Large-area transmissive type optical image modulator and method of manufacturing the same and optical apparatus including transmissive type optical image modulatorSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Nov 10, 2015·2 cites·22 claims
- 2372US8587561B2Multi-sensing touch panel and display apparatus using the sameKIM WOON-BAE·Filed 2010·Granted Nov 19, 2013·3 cites·23 claims
- 2465US8730368B2Light transmittance adjusting device, image apparatus including the same, and method of fabricating the light transmittance adjusting deviceKWON JONG-OH·Filed 2012·Granted May 20, 2014·1 cites·18 claims
- 2562US7510968B2Cap for semiconductor device package, and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 31, 2009·2 cites·10 claims
- 2660US9429775B2Infrared transmission large-area shutterSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 30, 2016·0 cites·14 claims
- 2759US6965281B2FBAR, FBAR based duplexer device and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2004·Granted Nov 15, 2005·7 cites·15 claims
- 2858US8480917B2Solid electrolyte polymer, polymer actuator using cross-linked polyvinylidene fluoride-based polymer, and method of manufacturing the polymer actuatorKWON JONG-OH·Filed 2009·Granted Jul 9, 2013·0 cites·19 claims
- 2957US8004771B2Varifocal lens and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Aug 23, 2011·1 cites·26 claims
- 3057US7282388B2Method of manufacturing wafer level package type FBAR deviceSAMSUNG ELECTRO MECH·Filed 2004·Granted Oct 16, 2007·7 cites·5 claims
- 3156US7241966B2Wafer level package fabrication method using laser illuminationSAMSUNG ELECTRO MECH·Filed 2004·Granted Jul 10, 2007·7 cites·7 claims
- 3256US6946320B2FBAR based duplexer device and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2004·Granted Sep 20, 2005·6 cites·6 claims
- 3353US2024186291A1Semiconductor die stack structureSK HYNIX INC·Filed 2023·Application pending·0 cites
- 3450US2013117980A1Electroactive polymer actuator and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 3549US2013264912A1Method of manufacturing pvdf-based polymer and method of manufacturing multilayered polymer actuator using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 3645US2005174193A1FBAR based duplexer device and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 3741US10562593B2Frictional resistance-reducing device and ship including sameSAMSUNG HEAVY IND·Filed 2016·Granted Feb 18, 2020·0 cites·14 claims
- 3841US9543275B2Semiconductor package with a lead, package-on-package device including the same, and mobile device including the sameCHO YUN-RAE·Filed 2015·Granted Jan 10, 2017·0 cites·5 claims
- 3939US2013049646A1Energy conversion device and methods of manufacturing and operating the sameKIM CHE-HEUNG·Filed 2012·Application pending·0 cites
- 4038US2008292814A1Image forming element and fabricating method thereof, and image forming apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 4133US2016013159A1Chip, chip-stacked package using the same, and method of manufacturing the chip-stacked packageKWON JONG-OH·Filed 2015·Application pending·0 cites
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