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Inventor
TAM WAI KIT
HK
2 patents
⚠️ This page may combine multiple inventors who share the name “TAM WAI KIT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MCLELLAN NEIL
1 patent
US8610262B1
Dec 17, 2013
Ball grid array package with improved thermal characteristics
MCLELLAN NEIL
9 citations
81
UTAC HONG KONG LTD
1 patent
US9449903B2
Sep 20, 2016
Ball grid array package with improved thermal characteristics
UTAC HONG KONG LTD
3 citations
70