Inventor
CHEN NAN-CHENG
TW31 patents
⚠️ This page may combine multiple inventors who share the name “CHEN NAN-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MEDIATEK INC
26 patentsUS7786557B2Aug 31, 2010
QFN Semiconductor package
MEDIATEK INC35 citations95
US7838975B2Nov 23, 2010
Flip-chip package with fan-out WLCSP
MEDIATEK INC37 citations92
US9165877B2Oct 20, 2015
Fan-out semiconductor package with copper pillar bumps
MEDIATEK INC8 citations84
US8044496B2Oct 25, 2011
QFN semiconductor package
MEDIATEK INC9 citations83
US10847869B2Nov 24, 2020
Semiconductor package having discrete antenna device
MEDIATEK INC9 citations82
US9158880B2Oct 13, 2015
Layout method for printed circuit board
MEDIATEK INC6 citations82
US10991669B2Apr 27, 2021
Semiconductor package using flip-chip technology
MEDIATEK INC3 citations73
US10680727B2Jun 9, 2020
Over the air wireless test system for testing microelectronic devices integrated with antenna
MEDIATEK INC2 citations73
US11373957B2Jun 28, 2022
Semiconductor package with layer structures, antenna layer and electronic component
MEDIATEK INC2 citations72
US11322823B2May 3, 2022
Antenna-in-package with frequency-selective surface structure
MEDIATEK INC2 citations72
US10784206B2Sep 22, 2020
Semiconductor package
MEDIATEK INC2 citations72
US10515887B2Dec 24, 2019
Fan-out package structure having stacked carrier substrates and method for forming the same
MEDIATEK INC3 citations71
US10128192B2Nov 13, 2018
Fan-out package structure
MEDIATEK INC2 citations71
US9846756B2Dec 19, 2017
Layout method for printed circuit board
MEDIATEK INC2 citations71
US10103128B2Oct 16, 2018
Semiconductor package incorporating redistribution layer interposer
MEDIATEK INC3 citations70
US12557215B2Feb 17, 2026
Semiconductor package using flip-chip technology
MEDIATEK INC0 citations62
US11908759B2Feb 20, 2024
Semiconductor device
MEDIATEK INC0 citations62
US11837552B2Dec 5, 2023
Semiconductor package with layer structures, antenna layer and electronic component
MEDIATEK INC0 citations62
US9331054B2May 3, 2016
Semiconductor package assembly with decoupling capacitor
MEDIATEK INC2 citations62
US8039933B2Oct 18, 2011
QFN semiconductor package
MEDIATEK INC2 citations62
US11848481B2Dec 19, 2023
Antenna-in-package with frequency-selective surface structure
MEDIATEK INC0 citations61
US11721882B2Aug 8, 2023
Semiconductor package having discrete antenna device
MEDIATEK INC0 citations60
US9674941B2Jun 6, 2017
Printed circuit board for mobile platforms
MEDIATEK INC1 citations52
US9131602B2Sep 8, 2015
Printed circuit board for mobile platforms
MEDIATEK INC0 citations52
US8039319B2Oct 18, 2011
Method for fabricating QFN semiconductor package
MEDIATEK INC0 citations51
US7561481B2Jul 14, 2009
Memory controllers and pad sequence control methods thereof
MEDIATEK INC0 citations47