Inventor

AOKI HIDEMITSU

JP70 patents

⚠️ This page may combine multiple inventors who share the name “AOKI HIDEMITSU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AOKI HIDEMITSU

NEC CORP

Substrate-cleaning method and substrate-cleaning solution

Method for wet processing of a semiconductor substrate

Etching and cleaning methods and etching and cleaning apparatus used therefor

Method for cleaning semiconductor wafer after chemical mechanical polishing on copper wiring

Method of manufacturing semiconductor device having multilayer wiring

Method and system for generating electrolyzed water

Method and apparatus for cleaning electronic parts

Electrolytic ionized water producing apparatus

Method and apparatus for wet treatment of solid surfaces

Manufacturing method of semicondcutor device

Method for producing electrolyzed water

Method for producing electrolyzed water

Method for removing dry-etching residue in a semiconductor device fabricating process

Substrate-cleaning method and substrate-cleaning solution

Method of supplying a chemical mechanical polishing liquid and apparatus therefor

Method for manufacturing semiconductor device

Zeta-potential determining apparatus

Substrate cleaning method and apparatus

Method for analyzing contamination within hole in semiconductor device

Method for cleaning a substrate and cleaning solution

Method for producing electrolyzed water

Wet processing apparatus having individual reactivating feedback paths for anode and cathode water

Anticorrosive agent

Stripping agent composition and method of stripping

Method of manufacturing a semiconductor device

Method of washing a semiconductor device

Method of manufacturing semiconductor device having multilayer wiring

Method for collecting a metallic contaminants from a wafer

NEC ELECTRONICS CORP

Semiconductor device and method of manufacturing the same capable of reducing deterioration of low dielectric constant film

Washing liquid composition for semiconductor substrate

Etching and cleaning methods and etching and cleaning apparatuses used therefor

Method of manufacturing semiconductor device and apparatus for cleaning substrate

Method of forming a semiconductor device by simultaneously cleaning both sides of a wafer using different cleaning solutions

Stripping composition

Cleaning method, method for fabricating semiconductor device and cleaning solution

Semiconductor wafer surface and method of treating a semiconductor wafer surface

Method of washing a semiconductor wafer

Method and apparatus for storing a semiconductor wafer after its CMP polishing

Manufacturing method of semiconductor device

Semiconductor device having a roughened surface

Post-CMP washing liquid composition

Semiconductor device fabricating method and treating liquid

Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device

Cleaning water for cleaning a wafer and method of cleaning a wafer

Method for cleaning semiconductor wafer after chemical mechanical polishing on copper wiring

KANTO KAGAKU

Cleaning solution for semiconductor substrate

Cleaning solution for cleaning substrates to which a metallic wiring has been applied

Photoresist residue remover composition

SUMITOMO CHEMICAL CO

Anticorrosive treating concentrate

RENESAS ELECTRONICS CORP

Etching and cleaning methods and etching and cleaning apparatuses used therefor